Engineering
Models
100%
Insulated Gate Bipolar Transistor
78%
Reliability Analysis
75%
Metal-Oxide-Semiconductor Field-Effect Transistor
68%
Design
67%
Thermal Model
63%
Semiconductor
58%
Power Device
41%
Failure (Mechanical)
41%
Aging
40%
Simulation Result
39%
Heatsinks
38%
Power Electronics
38%
Temperature Distribution
35%
Inverter
34%
Estimation
33%
Thermal Stress
33%
Elements
31%
Energy Conversion
28%
Short Circuit Condition
27%
Couplings
26%
Joints (Structural Components)
25%
Power Converter
25%
Demonstrates
25%
Experiments
24%
Junction Temperature
23%
Experimental Result
23%
Networks (Circuits)
22%
Mechanical Stress
21%
Reduction
20%
Power Electronic Converter
19%
Power Loss
19%
Computer Simulation
18%
Electronic Power Circuit
17%
Finite Element Simulation
17%
Power Cycle
16%
Characteristics
15%
Temperature Estimation
14%
Cooling Performance
14%
Error
13%
Cooling Condition
13%
Coupling Effect
13%
Thermal Dissipation
13%
Buck Converter
13%
Current Switch
13%
Stages
12%
Ambient Temperature
12%
Thermal Performance
12%
Harmonics
11%
Machine Learning Algorithm
11%
Material Science
Bipolar Transistor
74%
Temperature
74%
Finite Element Methods
46%
Power Electronics
35%
Electronic Circuit
33%
Power Device
21%
Silicon Carbide
19%
Soldering Alloys
19%
Thermal Stress
17%
Metal-Oxide-Semiconductor Field-Effect Transistor
15%
Heat Transfer
14%
Diode
12%
Devices
12%
Thermal Analysis
11%
Mechanical Property
10%
Copper
10%
Surface
9%
Characterization
8%
Thermal Aging
8%
Velocity
8%
Particle
8%
Fluid
8%
Thermal Shock
8%
Solder Joint
8%
Computational Fluid Dynamics
8%
Semiconductor Device
8%
Heat Resistance
8%
Flow Boiling
8%
Mechanical Strength
8%
Crack
8%
Finite Element Modeling
8%
Heat Sink
8%
Silicon
8%
Semiconductor Material
7%
Electrochemical Reaction
6%
Non-Destructive Testing
5%
Electronic Component
5%
Coolant
5%
Ferrite
5%
Density
5%
