• Pontoppidanstræde 101, 2-025

    9220 Aalborg Ø

    Denmark

20132021

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  • 2018

    Computer-aided engineering simulations

    Bahman, A. S. & Iannuzzo, F., Jun 2018, Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability. Suganuma, K. (ed.). Woodhead Publishing, p. 199 - 223 25 p. (Elsevier).

    Research output: Contribution to book/anthology/report/conference proceedingBook chapterResearchpeer-review

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