Projects per year
Personal profile
Education/Academic qualification
Energy Technology, Mission profile based system-level lifetime prediction of modular multilevel converters
Award Date: 26 Feb 2020
Fingerprint
- 1 Similar Profiles
Collaborations from the last five years
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AI-Power: Artificial Intelligence for Next-Generation Power Electronics
Blaabjerg, F., Wang, H., Sahoo, S., Zhao, S., Zhang, Y. & Frøstrup, S.
01/09/2022 → 31/08/2027
Project: Research
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Collaborative Research Network on New Testing Concepts for Power Electronics
01/01/2021 → 31/12/2022
Project: Research
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UTRC: Prognostics and Health Management on Power Electronics
Wang, H., Zhang, Y., Zhao, S. & Østergaard, J.
United Technologies Research Centre Ireland Ltd.
01/10/2019 → 28/02/2020
Project: Research
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Light-AI for Cognitive Power Electronics
Wang, H., Yang, B., Zhao, S. & Zhang, Y.
01/08/2019 → 31/07/2023
Project: Research
Research output
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Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Blaabjerg, F. & Saeedifard, M., Jul 2020, In: IEEE Transactions on Power Electronics. 35, 7, p. 6916-6930 15 p., 8926422.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile53 Citations (Scopus)421 Downloads (Pure) -
Simplified Thermal Modeling for IGBT Modules with Periodic Power Loss Profiles in Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., Mar 2019, In: IEEE Transactions on Industrial Electronics. 66, 3, p. 2323-2332 10 p., 8331948.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile96 Citations (Scopus)976 Downloads (Pure) -
A Viable Mission Profile Emulator for Power Modules in Modular Multilevel Converters
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., Dec 2019, In: IEEE Transactions on Power Electronics. 34, 12, p. 11580 - 11593 14 p., 8678463.Research output: Contribution to journal › Journal article › Research › peer-review
File21 Citations (Scopus)269 Downloads (Pure) -
A Guideline for Silicon Carbide MOSFET Thermal Characterization based on Source-Drain Voltage
Zhang, Y., Zhang, Y., Xu, Z., Wang, Z., Wong, H., Lu, Z. & Caruso, A., 2023, 2023 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, p. 378-385 8 p. 10131449. (IEEE Applied Power Electronics Conference and Exposition (APEC)).Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
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Aging Investigation of the Latest Standard Dual Power Modules Using Improved Interconnect Technologies by Power Cycling Test
Zhang, Y., Wu, R., Iannuzzo, F. & Wang, H., Nov 2022, In: Microelectronics Reliability. 138, 114740.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile5 Citations (Scopus)74 Downloads (Pure)
Datasets
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POWER CYCLING TEST DATASET (GEOL: A GRADIENT-BASED END-OF-LIFE CRITERION FOR POWER SEMICONDUCTOR MODULES)
Zhang, Y. (Contributor), Zhang, Y. (Creator) & Wang, H. (Contributor), IEEE DataPort, 1 Dec 2023
DOI: 10.21227/ksrt-zq09, https://ieee-dataport.org/documents/power-cycling-test-dataset-geol-gradient-based-end-life-criterion-power-semiconductor
Dataset
File -
CMT#10-3 IGBT power cycling data
Zhang, Y. (Creator), IEEE DataPort, 2021
DOI: 10.21227/zx0k-ky08, https://ieee-dataport.org/open-access/cmt10-3-igbt-power-cycling-data
Dataset
Prizes
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The First Place Prize Paper Award for 2020 in the IEEE Transactions on Power Electronics
Zhang, Yi (Recipient), Wang, Huai (Recipient), Wang, Zhongxu (Recipient), Blaabjerg, Frede (Recipient) & Saeedifard, Maryam (Recipient), 10 Aug 2021
Prize: Research, education and innovation prizes
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IEEE PELS Ph.D. Thesis Talk Award
Zhang, Yi (Recipient), 2020
Prize: Research, education and innovation prizes
Activities
- 1 Conference presentations
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Reproducible Thermal Structure Analysis along the Power Cycling of SiC MOSFETs
Yi Zhang (Lecturer)
12 Oct 2023Activity: Talks and presentations › Conference presentations
File
Press/Media
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Power Cycling of a Latest Standard “New Dual” IGBT Module for High Power Applications
09/02/2022
2 items of Media coverage
Press/Media: Press / Media
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HOW TO USE TEST & SIMULATION TO TACKLE FUTURE THERMAL CHALLENGES (AAU AND SIEMENS)
22/04/2021
1 item of Media coverage
Press/Media: Press / Media