Projects per year
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The fingerprint consists of automatically generated concepts related to the associated persons. It is updated automatically, when new content is added.
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AI-Power: Artificial Intelligence for Next-Generation Power Electronics
Blaabjerg, F., Wang, H., Sahoo, S., Zhao, S., Zhang, Y. & Frøstrup, S.
01/09/2022 → 31/08/2027
Project: Research
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Light-AI for Cognitive Power Electronics
Wang, H., Yang, B., Zhao, S. & Zhang, Y.
01/08/2019 → 31/07/2023
Project: Research
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Collaborative Research Network on New Testing Concepts for Power Electronics
01/01/2021 → 31/12/2022
Project: Research
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UTRC: Prognostics and Health Management on Power Electronics
Wang, H., Zhang, Y., Zhao, S. & Østergaard, J.
United Technologies Research Centre Ireland Ltd.
01/10/2019 → 28/02/2020
Project: Research
Research output
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Artificial Intelligence-Aided Thermal Model Considering Cross-Coupling Effects
Zhang, Y., Wang, Z., Wang, H. & Blaabjerg, F., Oct 2020, In: IEEE Transactions on Power Electronics. 35, 10, p. 9998-10002 5 p., 9034112.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile19 Citations (Scopus)132 Downloads (Pure) -
Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Blaabjerg, F. & Saeedifard, M., Jul 2020, In: IEEE Transactions on Power Electronics. 35, 7, p. 6916-6930 15 p., 8926422.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile39 Citations (Scopus)318 Downloads (Pure) -
Simplified Thermal Modeling for IGBT Modules with Periodic Power Loss Profiles in Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., Mar 2019, In: IEEE Transactions on Industrial Electronics. 66, 3, p. 2323-2332 10 p., 8331948.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile72 Citations (Scopus)890 Downloads (Pure) -
A Viable Mission Profile Emulator for Power Modules in Modular Multilevel Converters
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., Dec 2019, In: IEEE Transactions on Power Electronics. 34, 12, p. 11580 - 11593 14 p., 8678463.Research output: Contribution to journal › Journal article › Research › peer-review
File16 Citations (Scopus)245 Downloads (Pure) -
Condition Monitoring for Submodule Capacitors in Modular Multilevel Converters
Wang, H., Wang, H., Wang, Z., Zhang, Y., Pei, X. & Kang, Y., Nov 2019, In: IEEE Transactions on Power Electronics. 34, 11, p. 10403 - 10407 5 p., 8718539.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile32 Citations (Scopus)154 Downloads (Pure)
Datasets
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CMT#10-3 IGBT power cycling data
Zhang, Y. (Creator), IEEE DataPort, 2021
DOI: 10.21227/zx0k-ky08, https://doi.org/10.21227%2Fzx0k-ky08
Dataset
Prizes
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The First Place Prize Paper Award for 2020 in the IEEE Transactions on Power Electronics
Zhang, Yi (Recipient), Wang, Huai (Recipient), Wang, Zhongxu (Recipient), Blaabjerg, Frede (Recipient) & Saeedifard, Maryam (Recipient), 10 Aug 2021
Prize: Research, education and innovation prizes
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IEEE PELS Ph.D. Thesis Talk Award
Zhang, Yi (Recipient), 2020
Prize: Research, education and innovation prizes
Press/Media
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Power Cycling of a Latest Standard “New Dual” IGBT Module for High Power Applications
09/02/2022
2 items of Media coverage
Press/Media: Press / Media
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HOW TO USE TEST & SIMULATION TO TACKLE FUTURE THERMAL CHALLENGES (AAU AND SIEMENS)
22/04/2021
1 item of Media coverage
Press/Media: Press / Media