Engineering
Failure (Mechanical)
100%
Power Cycle
88%
Design
66%
Bonding Wire
66%
Thermal Stress Analysis
66%
Heat Cycle
66%
High Side
66%
Metal-Oxide-Semiconductor Field-Effect Transistor
66%
Temperature Distribution
66%
Models
42%
Lower Side
37%
Acoustics
33%
Simulation Result
31%
Energy Dissipation
29%
Switching Speed
22%
Measured Result
16%
Module Design
16%
Capacitive
14%
Miller Capacitance
14%
3d Simulation
9%
Optimization
9%
Test Sample
9%
Characteristics
9%
Stress Point
9%
Layer Structure
9%
Substrate Surface
9%
Parasitic Capacitance
9%
Physical Prototyping
9%
Adjacent Layer
9%
Operating Voltage
7%
Couplings
7%
Slew Rate
7%
Highlight
7%
Energy Engineering
7%
Significant Increase
7%
Material Science
Metal-Oxide-Semiconductor Field-Effect Transistor
66%
Thermal Stress
66%
Copper
66%
Stress Analysis
66%
Devices
66%
Capacitance
54%
Temperature
50%
Ceramics
33%
Surface
16%
Aluminum
16%
Mechanical Stress
16%
Power Electronics
9%
Semiconductor Device
9%
Earth and Planetary Sciences
Thermal Cycling Test
33%
Parameter
33%
Acoustic Microscope
33%
Failure Mechanism
33%
Inductance
33%
Thermal Resistance
33%
Scanning
33%
Failure
33%