1993 …2025

Research activity per year

Network

Jian Ren

  • Xidian University

External person

Yingzeng Yin

  • Xidian University

External person

Yuanan Liu

  • Beijing University of Posts and Telecommunications

External person

Claus Byskov

  • LM Wind Power

External person

Atsushi Yamamoto

  • Panasonic Holdings Corporation
  • Panasonic

External person

Xianqi Lin

  • University of Electronic Science and Technology of China

External person

Xiaoming Chen

  • Qamcom Research & Technology AB
  • Qamcom Research and Technology AB
  • Xi'an Jiaotong University

External person

Tsutomu Sakata

  • Panasonic Holdings Corporation

External person

Yongle Wu

  • Beijing University of Posts and Telecommunications

External person

K. Ogawa

  • Panasonic Holdings Corporation

External person

Zhugang Wang

  • National Space Science Center, Chinese Academy of Sciences

External person

Atsushi Yamamoto

  • Matsushita Electric Industrial Co., Ltd.
  • Matsushita Electric Industrial Co. Ltd.
  • Network Development Center, Matsushita Electric Industrial Co., Ltd.

External person

T. Hayashi

  • Panasonic Holdings Corporation

External person

T. Sakata

  • Panasonic Holdings Corporation

External person

Jan-Erik Mueller

  • Infineon Technologies AG

External person

Jia-Lin Li

  • University of Electronic Science and Technology of China

External person

A. Yamamoto

  • Panasonic Holdings Corporation

External person

Tao Hong

  • Xidian University

External person

Mikael Knudsen

  • Infineon Technologies Denmark A/S

External person

Koichi Ogawa

  • Matsushita Electric Industrial Co., Ltd.

External person

Mattias Gustafsson

  • Huawei Technologies Co., Ltd.

External person

Wen Jiang

  • Xidian University

External person

Pekka Kyösti

  • University of Oulu
  • Keysight Technologies

External person

Yonghui Huang

  • National Space Science Center, Chinese Academy of Sciences

External person

Koichi Ogawa

  • Panasonic Holdings Corporation

External person

Xian Qi Lin

  • University of Electronic Science and Technology of China
  • Jiangsu Henxin Technology Co

External person

Pekka Kyosti

  • Anite Telecoms Oy
  • Keysight Technologies
  • University of Oulu

External person

Jinxing Li

  • Huawei Technologies Co., Ltd.

External person

Jun-ichi Takada

  • Tokyo Institute of Technology

External person

Naizheng Zheng

  • Aalborg University

External person

Tommi Jamsa

  • Elektrobit, Oulu
  • Huawei Technologies Co., Ltd.

External person

Mikael Bergholz Knudsen

  • Infineon Technologies AG

External person

Toshiteru Hayashi

  • Matsushita Electric Industrial Co., Ltd.

External person

Abdolali Abdipour

  • Amirkabir University of Technology

External person

Morten Christensen

  • Molex Interconnect

External person

Bernd Adler

  • Infineon Technologies AG

External person

Ying Liu

  • Beijing Jiaotong University

External person

Thomas Bolin

  • Sony Group Corporation
  • Sony Mobile Communications AB
  • Network Technology
  • Ericsson AB
  • Sony Ericsson Mobile Communications AB

External person

Morten Christensen

  • Molex Interconnect - Antenna Business Unit

External person

Toshiteru Hayashi

  • Panasonic Mobile Communications Corporation

External person

Gerhard Steinbock

  • Huawei Technologies Co., Ltd.

External person

Mikael B. Knudsen

  • Infineon Technologies Denmark A/S

External person

Jianhua Zhang,

  • Beijing University of Posts and Telecommunications
  • Yanshan University

External person

Zhinong Ying

  • Sony Group Corporation

External person

Jianhua Zhang

  • Beijing University of Posts and Telecommunications

External person

A. Scannavini

  • SATIMO, Pomezia

External person

Pekka Kyösti

  • Anite Telecoms Oy

External person

Chao Luo

  • CAS - Aerospace Information Research Institute

External person

Zhenning Li

  • CAS - Aerospace Information Research Institute

External person

Olof Zander

  • Sony Group Corporation
  • Lund University

External person

Tong Wu

  • Zhejiang University

External person

Jun Wang

  • iCarbonX
  • China Agricultural University
  • University of Copenhagen
  • Macau University of Science and Technology
  • BGI-Shenzhen
  • Anhui Polytechnic University
  • Henan University of Technology

External person

Yiming Zhang

  • Sun Yat-Sen University

External person

Tianqi ZHANG

  • Chongqing University of Posts and Telecommunications

External person

Zhengpeng Wang

  • Beihang University

External person

Jun-ichi Takada

  • Tokyo Institute of Technology

External person

Martin Alm

  • Huawei Technologies Co., Ltd.

External person

Yonghui Huang

  • CAS - National Space Science Center

External person

Baoze Ma

  • Chongqing University of Posts and Telecommunications

External person

Morten Christensen

  • Molex, Antenna Business Unit

External person

Alex Oprea

  • Lyngsø Systems

External person

Naser Ojaroudiparchin

  • Aalborg University

External person

Gerhard Bauch

  • DoCoMo Eurolab

External person

Peter Bundgaard

  • Infineon Technologies AG

External person

Lei Wang

  • Hamburg University of Technology
  • Hunan University
  • Yanshan University
  • Soochow University
  • Electric Power Research Institute of State Grid Hebei Electric Power Company
  • Heriot-Watt University

External person

Morten Christensen

  • EMC Antenna Group, Motorola

External person

Y. Wu

  • Xi'an Jiaotong University

External person

Istvan Zsolt Kovacs

  • Nokia Siemens Networks

External person

Albert Gjedde

  • Aarhus University

External person

Thomas Kürner

  • Technische Universität Braunschweig

External person

Jaouhar Jemai

  • Ubisense AG, Munich

External person

Niels Kuster

  • Swiss Federal Institute of Technology Zurich

External person

Koichi Ogawa

  • Tokyo Tech

External person

Peter S Hall

  • Univ Birmingham

External person

K. Ogawa

  • Panasonic

External person

Lars Mølhave

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C
  • Aarhus University

External person

J. Christiansen

  • GomSpace A/S

External person

Reza Sarraf Shirazi

  • Amirkabir University of Technology

External person

Kin Lien Chee

  • Technical University of Braunschweig

External person

Søren K. Kjærgård

  • Aarhus University

External person

Qi Liu

  • Hangzhou Dianzi University

External person

David Pommerenke

  • EMC Laboratory, Missouri University of Science and Technology

External person

Miakel Bergholz Knudsen

  • Infineon Technologies

External person

Werner Schroeder

  • University of Applied Sciences Wiesbaden, Rüsselsheim

External person

Mikael Nilsson

  • Volvo Car Corporation

External person

Ying Liu

  • University of Copenhagen
  • CAS - Institute of Microbiology
  • Beijing Jiaotong University
  • Swedish University of Agricultural Sciences

External person

Morten Christensen

  • Molex Interconnect, Antenna Business Unit

External person

Tong Wu

  • Zhejiang University

External person

Thomas Kurner

  • Technische Universitet Braunschweig

External person

Dong-Seek Park

  • Samsung Electronics

External person

Torben Sigsgaard

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C

External person

H. Gao

  • Sichuan University

External person

Martin Jacob

  • Technical University of Braunschweig

External person

Toshiteru Hayashi

  • Matsushita Electric Industrial Co. Ltd.

External person

Jari Nurmi

  • Tampere University

External person

Petar Solic

  • University of Split

External person

Tim Brown

  • Centre for Communication Systems Research, University of Surrey

External person

Steven R. Best

  • MITRE Corporation

External person

Maja Skiljo

  • University of Split

External person

Jaouhar Jemai

  • IfN, Braunschweig Technical University

External person

Aliou Diallo

  • Université de Nice Sophia-Antipolis, LEAT - CNRS UMR

External person

Mikael Bergholz Knudsen

  • Infineon Tecnologies AG

External person

Orla Møller Petersen

  • Munin Spot Technologies Aps

External person

Ibra Dioum

  • Ecole Supérieure Polytechnique - Université Cheikh Anta Diop de Dakar, Département Génie Informatique

External person

Kristian Karlsson

  • Technical Research Institution of Sweden
  • SP Technical Research Institute of Sweden

External person

M. Straarup

  • Danfoss AS

External person

Howard Huang

  • Alcatel-Lucent

External person

Niels T. Andersen

  • Aarhus University

External person

Gunter Vermeeren

  • Ghent University

External person

Mats Gustafsson

  • Lund University
  • Sony Mobile Communications AB
  • Skåne University Hospital

External person

K. Sakaguchi

  • Graduate School of Science and Engineering, Tokyo Institute of Technology

External person

Fredrik Tufvesson

  • Lund University

External person

Toshiteru Hayashi

  • Panasonic Mobile Communications Co., Ltd

External person

Niels Trolle Andersen

  • Univ Aarhus, Sch Publ Hlth, Dept Biostat, DK-8000 Aarhus

External person

Koichi Ogawa

  • etwork Development Center, Matsushita Electric Industrial Co., Ltd.

External person

Anders D Pedersen

  • Hammel Neurorehabil & Res Ctr, Hammel

External person

Søren K. Christensen

  • Bang & Olufsen A/S

External person

Pekka Kyösti

  • Anite Telecoms Oy

External person

Maciej Klemm

  • Univ Bristol

External person

Gerhard Kristensson

  • Lund University

External person

Yuxiang Zhang

  • Beijing University of Posts and Telecommunications

External person

Boris Manev

  • Vrije Universiteit Amsterdam

External person

J Shin

  • WiSpry

External person

Søren K Kjaergaard

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C

External person

Wonbin Hong

  • Pohang University of Science and Technology

External person

Robert Zachariae

  • Aarhus University Hospital

External person

Changbin Xue

  • CAS - National Space Science Center

External person

Boyan Yanakiev

  • Molex Antenna Business Unit

External person

Persefoni Kyritsi

  • European Patent Office

External person

Yingsong Li

  • Harbin Engineering University

External person

Lars Bo Hansen

  • LM Wind Power

External person

Xiaoming Chen

  • Zhejiang University
  • Xi'an Jiaotong University

External person

L. J. Foged

  • SATIMO, Pomezia

External person

Tobias Holmgaard

  • Mekoprint A/S

External person

Bo Ai

  • Peng Cheng Laboratory
  • Zhengzhou University

External person

Torben Sigsgård

  • Aarhus University

External person

Guangsheng Deng

  • Hefei University of Technology

External person

Yusheng Zhang

  • Beihang University

External person

Bundgaard Peter

  • Infineon Technologies AG

External person

Chengxiang Wang

  • Heriot-Watt University

External person

Zoran Blazevic

  • University of Split

External person

Knud A. Baltsen

  • Bang & Olufsen A/S

External person

Markus Herdin

  • Rohde&Schwarz

External person

Matti Latva-aho

  • University of Oulu

External person

Maja Stella

  • University of Split

External person

A. Yamamoto

  • Panasonic

External person

Yong Fan

  • University of Electronic Science and Technology of China
  • University of Copenhagen

External person

Cyril Luxey

  • LEAT-CNRS, University of Nice-Sophia Antipolis

External person

I Dioum

  • Département Génie Informatique, Ecole Supérieure Polytechnique, Université Cheikh Anta Diop de Dakar

External person

Zuleita Ho

  • Sony Group Corporation

External person

Ingunn S. Riddervold

  • Aarhus University
  • Prehospital Emergency Medical Services

External person

Soon L. Ling

  • Vodafone Group Services Limited, Newbury

External person

Kai Mao

  • Nanjing University of Aeronautics and Astronautics
  • University of Twente

External person

Thomas Kürner

  • IfN, Braunschweig Technical University

External person

Wei Wang

  • Beijing Jiaotong University

External person

Jianying Li

  • Northwestern Polytechnical University Xian

External person

Theodoros Samaras

  • University of Thessaloniki

External person

Do-Young Kim

  • Samsung Electronics, Co. Ltd.

External person

Mikael Bergholz Knudsen

  • Infineon Technologies

External person

Kin Lien Chee

  • Technical University of Braunschweig

External person

Jan Welinder

  • SP Technical Research Institute of Sweden

External person

Thomas Kurner

  • Technical University of Braunschweig

External person

Ingunn Skogstad Riddervold

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C
  • Aarhus University

External person

Kjell Hansson Mild

  • Umeå University

External person

Gerhard Bauch

  • DoCoMo Euro-Labs

External person

Wei Min Wang

  • Beijing University of Posts and Telecommunications
  • Shandong University

External person

Arne Møller

  • Aarhus University
  • Sino-Danish Center for Education and Research
  • Aarhus University Hospital

External person

D. Gerhardt

  • GomSpace A/S

External person

Cheng-Xiang Wang

  • Southeast University, Nanjing
  • Purple Mountain Laboratories, Nanjing

External person

Alexandru Tatomirescu

  • Department of Telecommunications
  • Politehnica University of Bucharest

External person

Tim Brown

  • University of Surrey, Guildford

External person

Yu-Xiang Sun

  • The College of Electronics and Information Engineering

External person

Keong Kam

  • EMC Laboratory, Missouri University of Science and Technology

External person

E. Kuehne

  • Danfoss AS

External person

Young-Kwon Cho

  • Samsung Electronics CO., LTD
  • Samsung

External person

Philippe De Doncker

  • Univ Libre, Brussels

External person

Heng Wang

  • Beijing Key Laboratory of Work Safety Intelligent Monitoring
  • Beijing University of Posts and Telecommunications

External person

Yingzheng Yin

  • Xidian University

External person

Fredrik Tufvesson

  • Lund University

External person

Xingfeng Wu

  • Huawei Technologies Co., Ltd.

External person

Manos M. Tentzeris

  • Georgia Institute of Technology

External person

J. Estrada

  • Satimo, Kennesaw

External person

J. Takada

  • Graduate School of Science and Engineering, Tokyo Institute of Technology

External person

Sungtek Kahng

  • Incheon National University

External person

Mikael B. Knudsen

  • Infineon Technologies, Denmark A/S

External person

Sven Kuhn

  • Schmid & Partner Engineering AG

External person

Raed A. Abd-Alhameed

  • University of Bradford

External person

ZHENGPENG WANG

  • Beihang University

External person

Anders D. Pedersen

  • Hammel Research Center

External person

David A. Sánchez-Hernández

  • Technical University of Cartagena

External person

Martin Jacob

  • Technische Universitet Braunschweig

External person

Luc Martens

  • Ghent University

External person

Maozhong Song

  • Nanjing University of Aeronautics and Astronautics

External person

Kun Zhao

  • KTH Royal Institute of Technology

External person

Lars Mølhave

  • Aarhus University

External person

Yang Hao

  • Queen Mary Col/Univ London

External person

Andriy Radchenko

  • EMC Laboratory, Missouri University of Science and Technology

External person

Andrew Fort

  • Vrije Univ Brussels

External person

Bo Xu

  • Zhejiang University
  • KTH Royal Institute of Technology
  • Ericsson AB

External person

Qiuming Zhu

  • Nanjing University of Aeronautics and Astronautics

External person

Geun-Ho Lee

  • Yonsei University
  • Dankook University

External person

L. J. Foged

  • SATIMO, Pomezia, Italy & Motorola Mobility Inc., Libertyville

External person

Tan Yi

  • Heriot-Watt University

External person

T. Hayashi

  • Pansonic

External person

Toshiteru Hayashi

  • Communication System Development Center, Panasonic Mobile Communications Co.

External person

Cyril Luxey

  • Université de Nice Sophia-Antipolis, LEAT - CNRS UMR

External person

Zhao Xu

  • Huawei Technologies Co., Ltd.

External person

Morten Christensen

  • Molex Antenna Business Unit

External person

Gholamreza Moradi

  • Amirkabir University of Technology

External person

Robert Zachariae

  • Aarhus Univ Hosp, Psychooncol Res Unit, DK-8000 Aarhus

External person

Anxue Zhang

  • Xi'an Jiaotong University

External person

Guido Dietl

  • DoCoMo Euro-Labs

External person

Debang Liu

  • Chongqing University

External person

A. Diallo

  • LEAT-CNRS, University of Nice-Sophia Antipolis

External person

Le Yu

  • Southeast University, Nanjing

External person

Pekka Kyosti

  • University of Oulu
  • Keysight Technologies

External person