Engineering
Chip Interface
22%
Comparative Analysis
34%
Component Level
7%
Defects
22%
Design for Reliability
22%
Design Process
14%
Diffusion Coefficient
22%
Discrete Component
11%
Electric Vehicle
34%
Electrical Condition
11%
Enabling Technology
7%
Energy Application
11%
Energy Conservation
7%
Experimental Result
14%
Failure Mechanism
30%
Field Operation
15%
Finite Element Modeling
22%
Heating Time
22%
Humid Environment
22%
Junction Temperature
91%
Level Converter
7%
Measuring Temperature
22%
Metal-Oxide-Semiconductor Field-Effect Transistor
22%
Moisture Absorption
22%
Moisture Diffusion
22%
Moisture Transport
22%
Numerical Model
22%
Optical Fiber
79%
Photovoltaics
22%
Physical Modeling
22%
Platform Design
11%
Policymakers
11%
Power Device
15%
Power Electronic Converter
7%
Power Electronics
100%
Power Engineering
7%
Relative Humidity
22%
Reliability Analysis
10%
Reliability Estimation
22%
Reliability Standard
11%
Renewable Conversion
7%
Renewable Energy System
11%
Stress Condition
11%
Temperature Distribution
10%
Temperature Gradient
22%
Test Method
28%
Test Result
22%
Test System
22%
Testing Time
7%
Transmissions
7%
Keyphrases
Application-oriented Testing
7%
Bond Wire Degradation
22%
Chip Interface
11%
COMSOL Software
7%
DC Power
5%
Denmark
5%
Design Reliability
22%
Discrete Module
7%
Electric Vehicle Charging System
22%
Electronic Field
5%
Evaluation Results
5%
Gap Result
22%
Gate Resistance
22%
Health Status
5%
Junction Temperature
17%
Mask Defects
22%
Mask Layer
7%
Mission Profile
5%
Moisture Desorption
7%
Optical Fiber
22%
PCBA
7%
Photovoltaic Inverter
22%
Power Components
22%
Power Cycling
22%
Power Cycling Test
11%
Power Device
5%
Power Electronics
5%
Power Module
5%
Power Plant
5%
Power Semiconductor
5%
Proposed Design
5%
Reaction Simulation
7%
Reliability Growth
7%
Reliability Improvement
5%
Reliability Standard
11%
Sample Testing
7%
Semiconductor Components
5%
SiC MOSFET
22%
Solar Photovoltaic Industry
5%
Solder Mask
22%
Stress Loading
5%
Switching Speed
5%
Temperature Measurement
22%
Temperature Strain
11%
Temperature Swing
22%
Thermal Loading
5%
Thermal Stress
5%
Thermo-mechanical Finite Element Model
11%
Versatile Test
7%
Wide Bandgap (WBG) Devices
11%
