Engineering
Baseplate
39%
Bonding Wire
15%
Bottom Surface
7%
Capacitive
7%
Capacitive Coupling
36%
Carrier Concentration
7%
Charge Carrier
7%
Conductive
9%
Crystalline Quality
7%
Current Source
15%
Dislocation Density
15%
Electric Field
15%
Electrical Performance
7%
Energy Dissipation
31%
Energy Engineering
34%
Energy Gap
18%
Field Distribution
15%
Good Correlation
7%
Heating Process
10%
Heatsinks
15%
Heterostructures
15%
Induction Heating
47%
Liquid Cooling
21%
Main Benefit
7%
Metal-Oxide-Semiconductor Field-Effect Transistor
100%
Microchannel
7%
Miller Capacitance
26%
Mitigation Strategy
7%
Module Design
14%
Mosfets
12%
Nitride
17%
Operating Frequency
7%
Output Power
7%
Positive Feedback Loop
7%
Power Cycle
15%
Power Electronics
19%
Power Generation
15%
Printed Circuit Board
26%
Radio Frequency
15%
Review Paper
7%
Semiconductor Device
6%
Si Substrate
7%
Soft-Switching
7%
Sustained Oscillation
15%
Switching Loss
21%
Switching Speed
17%
Test Setup
7%
Thermal Characterization
15%
Thermal Loads
5%
Thermal Performance
32%
Keyphrases
10 kV SiC MOSFET
31%
3D-printed Ceramic
13%
AlN Buffer Layer
10%
Base Plate
19%
Capacitive Coupling
9%
Charge Carrier Concentration
5%
Chip Surface
5%
Coating Parameters
7%
Crystal Quality
5%
Design Approach
5%
Dislocation Density
5%
Film Composition
5%
Flow Condition
5%
GaN Films
5%
GaN Growth
5%
High-side
15%
Induction Heating
15%
Integrated Heat Spreader
15%
Integrated Media
15%
Integrated Microchannel
7%
Load Variation
15%
MHz Operation
11%
Miller
15%
Module Analysis
15%
Nonlinear Conductivity
15%
Oscillation
7%
Peak Electric Field
7%
Planar Winding
15%
Power Module
13%
Power Module Packaging
9%
Push-pull
15%
Push-pull Inverter
5%
Resonant Converter
15%
Resonant Inverter
15%
RF Heating Systems
5%
SiC MOSFET
9%
SiC MOSFET Module
15%
Solid State
7%
Solid-state Technology
15%
State-based
7%
Surface Temperature Measurement
5%
Sustained Oscillations
15%
Switching Regime
7%
Thermal Characterization
15%
Threading Dislocation
5%
Threading Dislocation Density
5%
Unusual Phenomenon
5%
Vacuum Tube
7%
Winding Pattern
7%
Wire Temperature
7%