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Collaborations from the last five years
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CoDE: Center of Digitalized Electronics (CoDE)
Munk-Nielsen, S. (PI), Jørgensen, A. B. (CoPI), Uhrenfeldt, C. (CoPI), Beczkowski, S. (Project Participant), Ahmad, F. (Project Participant), Meinert, J. D. (Project Participant), Kubulus, P. P. (Project Participant), Takahashi, M. (Project Participant), Sun, Z. (Project Participant), Wang, R. (Project Participant), Gao, Y. (Project Participant), Zäch, M. R. (Project Participant), Meyer, S. (Project Participant), Liccardi, S. (Project Participant), Kristensen, N. H. (Project Participant) & Steffensen, B. (Project Coordinator)
01/01/2021 → 31/12/2026
Project: Research
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Design of Robust and Compact 15kV SiC MOSFET Power Modules
Gao, Y. (PI), Uhrenfeldt, C. (Supervisor), Munk-Nielsen, S. (Supervisor) & Wang, Q. (Supervisor)
01/04/2021 → 30/09/2024
Project: PhD Project
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Gate Driver Power Supply With Low-Capacitance-Coupling and Constant Output Voltage for Medium-Voltage SiC MOSFETs
Yan, Z., Liu, G., Luan, S., Gao, Y., Wang, R., Kjarsgaard, B. F., Nielsen, M. R., Rannestad, B., Zhao, H. & Munk-Nielsen, S., 2025, (Accepted/In press) In: IEEE Transactions on Power Electronics .Research output: Contribution to journal › Journal article › Research › peer-review
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Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules
Gao, Y., Yin, K., Bak, C. L., Jørgensen, A. B., Zhang, Z., Zhao, H., Munk-Nielsen, S., Uhrenfeldt, C. & Aunsborg, T. S., Apr 2025, In: I E E E Transactions on Power Electronics. 40, 4, p. 5999-6009 11 p.Research output: Contribution to journal › Journal article › Research › peer-review
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POWER MODULE WITH REDUCED TRIPLE POINT MAXIMUM ELECTRIC FIELD
Uhrenfeldt, C. (Inventor), Gao, Y. (Inventor), Aunsborg, T. S. (Inventor) & Munk-Nielsen, S. (Inventor), 16 Jan 2025, IPC No. H01L 23/24 2006.1, H01L 23/62 2006.1, H01L 23/373 2006.1, H01L 25/07 2006.1, World Intellectual Property Organization (WIPO), Patent No. WO/2025/012219, 8 Jul 2024Research output: Patent
Open Access -
Accelerated Voltage Endurance Test and Insulation Lifetime Estimation of Silicone-Gel Encapsulated Direct-Bond-Copper Substrates for Medium-Voltage Power Module Packaging
Gao, Y., Zhang, Z., Zintak, Z., Arriola, E., Aunsborg, T. S., Munk-Nielsen, S. & Lu, G.-Q., 12 Mar 2024, CIPS 2024; 13th International Conference on Integrated Power Electronics Systems. VDE Verlag GMBH, p. 341-345 5 p.Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
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Application and Benefit Analysis of Guard Ring Methods in Reducing the Maximum Electric Field of Half Bridge Power Module
Gao, Y., Munk-Nielsen, S., Zhao, H., Meyer, S. & Aunsborg, T. S., 17 May 2024, 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia). IEEE (Institute of Electrical and Electronics Engineers), p. 4420-4425 6 p.Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
1 Citation (Scopus)