IEEE SPEC 2018 Best Paper Award

Prize: Conference prizes

Description

Best Paper Award to Mengxing Chen, Huai Wang, Frede Blaabjerg, Xiongfei Wang and Donghua Pan for the paper entitled "A Temperature-dependent Thermal Model of Silicon Carbide MOSFET Module for Long-term Reliability Assessment". This Prize was awarded by Jason Lai
Degree of recognitionInternational
Granting OrganisationsIEEE

Awarded at event

Event titleThe 4th IEEE Southern Power Electronics Conference, SPEC 2018
LocationNanyang Technological University, , SingaporeShow on map
Period10 Dec 2018 → 13 Dec 2018

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