Center Of Reliable Power Electronics (CORPE)

Project Details

Description

The Center of Reliable Power Electronics (CORPE) addresses better understanding of how reliability of power electronic devices and systems is influenced by different stress factors such as temperature, overvoltage and current, overload, environment. Furthermore, the center will develop device and system models that will enable simulation and design of power electronic systems very close to the limits of the devices and enable designed reliability. The knowledge will also be used online during operation to predict lifetime and enable smart derating of the equipment still in operation and ensure longer lifetime. The outcome will be that power electronic systems will be more reliable, more efficient, and more competitive (price), reducing maintenance and operation costs.
StatusFinished
Effective start/end date01/04/201131/12/2016

Activities

  • 1 Conference presentations
  • 1 Talks and presentations in private or public companies

Capacitors in Power Electronics Applications - Reliability and Circuit Design

Huai Wang (Lecturer)

24 Oct 2016

Activity: Talks and presentationsTalks and presentations in private or public companies

File

IEEE International Power Electronics and Application Conference and Exposition 2014

Huai Wang (Speaker)

4 Nov 20146 Nov 2014

Activity: Talks and presentationsConference presentations

Prizes

SPEC 2018 Best Papers Award

Chen, Mengxing (Recipient), Wang, Huai (Recipient), Blaabjerg, Frede (Recipient), Wang, Xiongfei (Recipient) & Donghua Pan (Recipient), 13 Dec 2018

Prize: Conference prizes

Research Output

Impact of Repetitive Short-Circuit Tests on the Normal Operation of SiC MOSFETs Considering Case Temperature Influence

Du, H., Reigosa, P. D., Ceccarelli, L. & Iannuzzo, F., 2020, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 11 p.

Research output: Contribution to journalJournal articleResearchpeer-review

File
  • 16 Downloads (Pure)

    A Lumped-Charge Approach Based Physical SPICE-Model for High Power Soft-Punch Through IGBT

    Duan, Y., Xiao, F., Luo, Y. & Iannuzzo, F., Mar 2019, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 7, 1, p. 62-70 9 p., 8482289.

    Research output: Contribution to journalJournal articleResearchpeer-review

    Open Access
    File
  • 3 Citations (Scopus)
    152 Downloads (Pure)

    A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

    Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., 24 May 2019, 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. USA: IEEE Press, p. 313-318 6 p. 8721785. (IEEE Applied Power Electronics Conference and Exposition (APEC)).

    Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

    File
  • 42 Downloads (Pure)