Keyphrases
Reliability Design Method
33%
SiC Power Module
33%
3D Simulation
33%
Power Semiconductor
33%
Copper Pattern
33%
Power Module
33%
3D Thermal Analysis
33%
Thermomechanical Reliability
33%
SiC Module
22%
High Breakdown Voltage
22%
Heat Cycle Test
22%
Physical Model
22%
Physical Parameters
22%
3D Model
22%
Energy-saving Technology
22%
Wire Temperature
16%
Thermomechanical Characteristics
16%
Module Structure
11%
Single Package
11%
Attracting Attention
11%
Reliability Characteristics
11%
Power Conversion
11%
SiC Power Semiconductors
11%
Structure Optimization
11%
Theoretical Properties
11%
Adjacent Layers
11%
Thermal Stress Simulation
11%
A12O3
11%
High Thermal Conductivity
11%
2-design
11%
Performance Improvement
11%
Reliability Evaluation
11%
Conventional Design
11%
Design-led
11%
Reliability Design
11%
Digital Design
11%
Product Design
11%
New Design Approach
11%
Si-based
11%
Electrical Equipment
11%
New Product Design
11%
Large Die
11%
Evaluated Temperature
11%
High Efficiency
11%
Product Design Methods
11%
Digitalize
11%
Reliability Capability
8%
Aluminum Wire
8%
Engineering
Metal-Oxide-Semiconductor Field-Effect Transistor
100%
Design Method
50%
Power Cycle
44%
3d Simulation
44%
Bonding Wire
33%
Thermal Stress Analysis
33%
Heat Cycle
33%
Temperature Distribution
33%
Structural Reliability
33%
Simulation Result
22%
Energy Conservation
16%
Lead Time
16%
Physical Parameter
16%
Product Design
16%
Breakdown Voltage
16%
Physical Model
16%
Mechanical Property
16%
Power Electronics
16%
Test Sample
11%
Stress Point
11%
Substrate Surface
11%
Parasitic Capacitance
11%
Physical Prototyping
11%
Adjacent Layer
11%
Layer Structure
11%
Thermal Stress
11%
Delamination
11%
Mechanical Stress
11%
Thermal Simulation
11%
Measured Result
8%
Module Design
8%
Power Conversion
8%
Electrical Equipment
8%
High Thermal Conductivity
8%
Reliability Evaluation
8%
Research Project
8%
Prototype
8%