Engineering
Design
100%
Power Cycle
88%
3d Simulation
76%
Bonding Wire
66%
Thermal Stress Analysis
66%
Heat Cycle
66%
Failure (Mechanical)
66%
Metal-Oxide-Semiconductor Field-Effect Transistor
66%
Temperature Distribution
66%
Models
59%
Simulation Result
31%
Semiconductor
22%
Characteristics
20%
Measured Result
16%
Module Design
16%
Optimization
15%
Energy Conservation
11%
Lead Time
11%
Short Time
11%
Physical Parameter
11%
Product Design
11%
Test Sample
9%
Stress Point
9%
Substrate Surface
9%
Parasitic Capacitance
9%
Physical Prototyping
9%
Adjacent Layer
9%
Layer Structure
9%
Power Conversion
5%
Electrical Equipment
5%
High Accuracy
5%
High Quality
5%
High Thermal Conductivity
5%
Reliability Evaluation
5%
Prototype
5%
Determines
5%
Research Project
5%
High Efficiency
5%
Material Science
Metal-Oxide-Semiconductor Field-Effect Transistor
66%
Copper
66%
Thermal Stress
66%
Stress Analysis
66%
Semiconductor Material
66%
Temperature
50%
Ceramics
33%
Product Design
33%
Surface
16%
Aluminum
16%
Mechanical Stress
16%
Electronics
16%
Capacitance
16%
Thermal Conductivity
16%