Engineering
Thermal Resistance
100%
Energy Gap
75%
Coefficient of Thermal Expansion
62%
Failure Mode
62%
Gap Semiconductor
50%
Joints (Structural Components)
50%
Multiscale Modeling
50%
Failure Mechanism
50%
Reliability Analysis Method
50%
Primary Factor
50%
Electronic Packaging
50%
Heterojunctions
50%
Wide Bandgap Semiconductor
50%
Visual Inspection
50%
Failure Analysis
50%
Material Interface
50%
Power Electronics
50%
Scanning Acoustic Microscopy
50%
Delamination
50%
Module Design
50%
Design Method
25%
Experimental Result
25%
Microstructure
25%
Finite Element Simulation
25%
Sampling Process
25%
Macroscale
25%
Multiscale Model
25%
Microscale
25%
Power Density
25%
Normal Distribution
25%
Sintering Temperature
25%
Poisson Ratio
25%
Young's Modulus
25%
Reliability Analysis
25%
Electrical Domain
25%
Potential Failure
12%
Simulation Result
12%
Assembly Process
12%
Failure Theory
12%
Semiconductor Material
12%
Process Step
12%
Test Method
12%
Design Optimization
12%
Keyphrases
GaN Power Device
50%
Wide Band Gap Semiconductors
50%
Multiscale Modeling Method
50%
Sintered Joint
50%
Thermal Cycling
50%
Reliability Analysis
50%
Power Electronics Packaging
50%
Electronic Packaging Reliability
50%
Combined Power
50%
Design Basis
50%
Digital Design
50%
Design Information
50%
Physics of Failure
25%
Packaging Reliability
25%
Digital Design Process
25%
Low Parasitic Inductance
25%
Soldering
25%
Failure Mechanism
25%
Thermal Resistance
25%
Electrical Parameters
25%
Thermal Cycling Test
25%
Scanning Acoustic Microscope
25%
Microscope Observation
25%
Thermal Parameters
25%
Reliability Level
25%
Macro Properties
16%
Silver Sintering
16%
Microscopic Void
16%
Representative Element
16%
Equivalent Poisson's Ratio
16%
Side Cooling
16%
Conchoidal Fracture
16%
High-frequency Applications
16%
Coefficient of Thermal Expansion
12%
Simulation Analysis
12%
Electronic System
12%
Design Optimization
12%
Reliability Test
12%
Materials Technology
12%
Packaging Structure
12%
Assembly Process
12%
Physical Causes
12%
Potential Failure Mode
12%
Thermo-mechanical Problem
12%
Semiconductor Materials
12%
Reliability Simulation
12%
Failure Form
12%
Effective Tool
12%
Packaging Technology
12%
China
12%
Semiconductor Packaging
12%
Failure Theory
12%
Physical Prototyping
12%
Actual Application
12%
Material Properties
12%
Prototype Construction
12%
Influencing Power
12%
Prediction Gap
12%
Maximum Junction Temperature
12%
Power Cycling Lifetime
12%
Internal Temperature Distribution
12%
Material Science
Density
50%
Wide Band Gap Semiconductor
50%
Thermal Cycling
50%
Thermal Expansion
37%
Sintering Temperature
25%
Young's Modulus
25%
Weibull Distribution
25%
Finite Element Methods
25%
Poisson Ratio
25%
Heterojunction
25%
Transistor
25%
Heat Resistance
25%
Interface Fracture
25%
Interface (Material)
25%
Electron Mobility
25%
Wide Bandgap Semiconductor
25%
Delamination
25%
Scanning Acoustic Microscopy
25%
Scanning Electron Microscopy
25%
Semiconductor Material
12%
Materials Property
12%