Electronics Manufactured for Climate

The overall objective of the ELMAC project is to develop a climate coupled proactive-design-and-monitoring strategy (PDMS) for industrial partner’s electronic products to tune their product to be robust for specific regional climate and secondly building connectivity to the device for predictive maintenance. Climate specifically means humidity, temperature, and pollutants level and their zonal variations defined by the Koppen climate classification for example. Outcome significantly cut the manufacturing, replacement and repair cost incurred due to unknown climate effects. The aim is to develop zonal Climate Transfer Function (CTF) models for coupling with semi-empirical modelling software tool for proactive-device-design, while incorporating climate effect sensing methods to monitor for predictive device health management and maintenance. The PDMS strategy of ELMAC add value from design phase (less use of proto-typing and no overdesign) to the application phase. Overall aim of ELMAC is based three interdependent goals (Figure 1 includes specific target for partners):
o Developing zonal CTF models by big data analysis of climate data combined with lab scale test data and mission profile data and coupling the CTF to build a semiempirical modelling software design tool.
o Developing a mission profile sensor module capable of online data transfer allowing connectivity to the devices for condition monitoring including exploring the applicability of IoT and digitization methods such as cloud-based connectivity.
o Developing climate coupled risk prediction models for climate related failure modes of Printed Circuit Board Assembly (PCBA) using probabilistic methods to translate sensor data for predictive maintenance decisions.
ELMAC outcome: new knowledge, a design verification software tool, sensor
product and associated software coupled with failure models. Expect progressive
implementation to partner’s products from 2 – 6 years in the horizon.