Fingerprint
Dive into the research topics of '3-D-Lumped Thermal Network Models for the Reliability Analysis of Fan-Cooled Plate-Fin Heatsink'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
3-D-Lumped Thermal Network Models for the Reliability Analysis of Fan-Cooled Plate-Fin Heatsink
Heping Fu, Jie Chen*, Hui Wang, Zhigang Liu, Henrik Sorensen, Amir Sajjad Bahman
*Corresponding author for this work
Research output: Contribution to journal › Journal article › Research › peer-review
6
Citations
(Scopus)