A Busbar Integrated SiC-based Converter with Embedded Heat-pipes

Yao Chang, Amir Sajjad Bahman, Haoze Luo, Wuhua Li, Xiangning He, Francesco Iannuzzo, Frede Blaabjerg

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review


In this paper, a bus-bar integrated packaging technology for press-pack power modules is proposed. The proposed packaging technology features high power-density, even pressure distribution among chips, and low stray parameters. The structure design and fabrication flow process are analyzed and experiments are made to verify the feasibility of proposed solution. The critical challenge about the package is related to thermal management. To reduce the thermal stress of chips, a heat-pipe integrated heatsink is developed and finite-element-method (FEM) simulations are used to evaluate the cooling performance of the proposed heatsink. The results demonstrate that the proposed heatsink has a relatively low cost and works effectively. It paves the way to better packaging design and more efficient thermal management method for high power devices.
Original languageEnglish
Title of host publicationProceedings of 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia)
Number of pages7
PublisherIEEE Press
Publication dateMay 2019
Article number8796953
ISBN (Electronic)9788957083130
Publication statusPublished - May 2019
Event10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia - Busan, Korea, Republic of
Duration: 27 May 201930 May 2019


Conference10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia
CountryKorea, Republic of
SeriesInternational Conference on Power Electronics


  • Heat pipe
  • Press-pack packaging technology
  • Stray inductance
  • Thermal management

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