A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High Power IGBT Modules

Research output: Contribution to journal › Journal article › Research › peer-review

246 Citations (Scopus)

3358 Downloads (Pure)

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APETT: Advanced Power Electronic Technology and Tools
Blaabjerg, F. (PI), Munk-Nielsen, S. (CoI), Iannuzzo, F. (Project Participant), Wang, H. (Project Participant), Uhrenfeldt, C. (Project Participant), Beczkowski, S. M. (Project Participant), Zhou, D. (Project Participant), Choi, U. (Project Participant), Jørgensen, A. B. (Project Participant), Vernica, I. (Project Participant), Sangwongwanich, A. (Project Participant), Christensen, N. (Project Participant), Ceccarelli, L. (Project Participant), Nielsen, C. K. (Project Participant), Bahman, A. S. (Project Participant), Pedersen, K. (Project Participant), Pedersen, K. B. (Project Participant) & Kristensen, P. K. (Project Participant)
Innovation Fund Denmark
01/01/2017 → 30/06/2021
Project: Research
Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F. (PI), Munk-Nielsen, S. (Project Participant), Pedersen, K. (Project Participant) & Popok, V. (Project Participant)
01/04/2011 → 31/12/2016
Project: Research

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