A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

Zhongxu Wang; Huai Wang; Yi Zhang; Frede Blaabjerg

doi:10.1109/APEC.2019.8721785

A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

Zhongxu Wang, Huai Wang, Yi Zhang, Frede Blaabjerg

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

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Abstract

Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.

Original language	English
Title of host publication	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Number of pages	6
Place of Publication	USA
Publisher	IEEE Press
Publication date	24 May 2019
Pages	313-318
Article number	8721785
ISBN (Print)	978-1-5386-8331-6
ISBN (Electronic)	9781538683309
DOIs	https://doi.org/10.1109/APEC.2019.8721785
Publication status	Published - 24 May 2019
Event	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, United States Duration: 17 Mar 2019 → 21 Mar 2019

Conference

Conference	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Country/Territory	United States
City	Anaheim
Period	17/03/2019 → 21/03/2019
Sponsor	IEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), Power Sources Manufacturers Association (PSMA)

Series	IEEE Applied Power Electronics Conference and Exposition (APEC)
ISSN	2470-6647

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10.1109/APEC.2019.8721785

A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel ConvertersSubmitted manuscript, 2.14 MB

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@inproceedings{40484e198cc243ab8af4d47cb1ff15fe,

title = "A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters",

abstract = "Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.",

author = "Zhongxu Wang and Huai Wang and Yi Zhang and Frede Blaabjerg",

year = "2019",

month = may,

day = "24",

doi = "10.1109/APEC.2019.8721785",

language = "English",

isbn = "978-1-5386-8331-6",

series = "IEEE Applied Power Electronics Conference and Exposition (APEC)",

publisher = "IEEE Press",

pages = "313--318",

booktitle = "34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019",

note = "34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 ; Conference date: 17-03-2019 Through 21-03-2019",

}

Wang, Z, Wang, H , Zhang, Y & Blaabjerg, F 2019, A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters. in 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019., 8721785, IEEE Press, USA, IEEE Applied Power Electronics Conference and Exposition (APEC), pp. 313-318, 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019, Anaheim, United States, 17/03/2019. https://doi.org/10.1109/APEC.2019.8721785

A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters. / Wang, Zhongxu; Wang, Huai ; Zhang, Yi et al.
34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. USA: IEEE Press, 2019. p. 313-318 8721785 (IEEE Applied Power Electronics Conference and Exposition (APEC)).

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

AU - Wang, Zhongxu

AU - Wang, Huai

AU - Zhang, Yi

AU - Blaabjerg, Frede

PY - 2019/5/24

Y1 - 2019/5/24

N2 - Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.

AB - Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.

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U2 - 10.1109/APEC.2019.8721785

DO - 10.1109/APEC.2019.8721785

M3 - Article in proceeding

SN - 978-1-5386-8331-6

T3 - IEEE Applied Power Electronics Conference and Exposition (APEC)

SP - 313

EP - 318

BT - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019

PB - IEEE Press

CY - USA

T2 - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019

Y2 - 17 March 2019 through 21 March 2019

ER -

A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

Abstract

Conference

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AUB Link

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Center Of Reliable Power Electronics (CORPE)

Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters

Cite this

A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

Abstract

Conference

Access to Document

AUB Link

Other files and links

Fingerprint

Projects

Center Of Reliable Power Electronics (CORPE)

Research output

Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters

Cite this