A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

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Abstract

Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.

Original languageEnglish
Title of host publication34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Number of pages6
Place of PublicationUSA
PublisherIEEE Press
Publication date24 May 2019
Pages313-318
Article number8721785
ISBN (Print)978-1-5386-8331-6
ISBN (Electronic)9781538683309
DOIs
Publication statusPublished - 24 May 2019
Event34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, United States
Duration: 17 Mar 201921 Mar 2019

Conference

Conference34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Country/TerritoryUnited States
CityAnaheim
Period17/03/201921/03/2019
SponsorIEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), Power Sources Manufacturers Association (PSMA)
SeriesIEEE Applied Power Electronics Conference and Exposition (APEC)
ISSN2470-6647

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