Engineering
Accuracy
14%
Baseplate
14%
Centrifugal Force
14%
Computer Simulation
14%
Cooling Performance
14%
Copper Substrate
14%
Design
57%
Design Result
14%
Enhancement
14%
Heat Transfer Coefficient
14%
Heatsinks
100%
Hot Spot
14%
Insulated Gate Bipolar Transistor
28%
Models
14%
Modules
14%
Performance
14%
Recirculation
14%
Reliability
14%
Simulation
14%
Thermal Resistance
14%
Three-Dimensional Models
14%
Earth and Planetary Sciences
Accuracy
14%
Area
14%
Aspect
14%
Augmentation
14%
Centrifugal Force
14%
Circulation
14%
Creativity
14%
Effectiveness
14%
Extrapolation
14%
Fin
85%
Grease
14%
Heat Transfer Coefficient
14%
Heat Transmission
14%
Hot Spot
14%
Increasing
14%
Investigation
14%
Model
14%
Reliability
14%
Revision
14%
Route
14%
Show
14%
Silicon
14%
Simulation
14%
Solder
14%
Thermal Resistance
14%
Three Dimensional Models
14%
Physics
Area
14%
Circulation
14%
Coolant
28%
Extrapolation
14%
Increasing
14%
Model
14%
Performance
14%
Reliability
14%
Revisions
14%
Silicon
14%
Simulation
14%
Solder
14%
Thermal Resistance
14%
Three Dimensional Models
14%
Computer Science
Accuracy
14%
Chip Temperature
14%
Design
57%
Generation
14%
Hotspot
14%
Numerical Simulation
14%
Simulation
14%
Simulation Mode
14%
Thermal Management
14%
Thermal Resistance
14%
Material Science
Coolant
14%
Heat Resistance
14%
Power Device
28%
Soldering Alloys
14%