A Modular Fractional-order Circuit Model for Broadband Impedance Characterization of Polymeric Insulation Systems

Xize Dai*, Andrea Cavallini, Jian Hao, Ruijin Liao, Claus Leth Bak, Huai Wang

*Corresponding author for this work

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

1 Citation (Scopus)

Abstract

Power assets driven by semiconductor devices are developing towards high-voltage (HV), miniaturization, and high-power density, which are posing serious threats, e.g.,electrothermal stresses on insulation systems as the weakestpoints. Therefore, modeling impedance characteristics of insulation systems is a crucial step to support the insulation design and reliability analysis of HV power assets. This paper proposes a modular broadband impedance characteristic modeling approach for insulation systems, which can apply to multifrequency applications. The proposed new impedance circuit model fully considers the intrinsic conductance behavior and relaxation mechanisms of insulation systems over broadband frequencies. Meanwhile, the fractional calculus theory is introduced to assist in modeling the frequency-dependent dielectric response characteristics for nonideal insulation systems. The new circuit model is based on in-depth physical insights and is modular and user-friendly. It enables a better representation of the broadband impedance characteristics of insulation systems.
Original languageEnglish
Title of host publication2024 IEEE 5th International Conference on Dielectrics (ICD)
PublisherIEEE (Institute of Electrical and Electronics Engineers)
Publication date29 Apr 2024
Article number10613071
ISBN (Print)979-8-3503-0898-3
ISBN (Electronic)979-8-3503-0897-6
DOIs
Publication statusPublished - 29 Apr 2024
Event2024 IEEE 5th International Conference on Dielectrics (ICD) - Toulouse, France
Duration: 30 Jun 20244 Jul 2024

Conference

Conference2024 IEEE 5th International Conference on Dielectrics (ICD)
Country/TerritoryFrance
CityToulouse
Period30/06/202404/07/2024
SeriesIEEE International Conference on Dielectrics (ICD)
ISSN2834-8311

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