A Multi-Layer RC Thermal Model for Power Modules Adaptable to Different Operating Conditions and Aging

Mohsen Akbari, Amir Sajjad Bahman, Mohammad Tavakoli Bina, Bahman Eskandari, Francesco Iannuzzo, Frede Blaabjerg

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

1 Citation (Scopus)
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Abstract

Semiconductor devices are often the most vulnerable components of power electronics converters among which thermal failures are the most likely ones. Thus, more accurate but straightforward thermal models are needed to efficiently do actions such as lifetime prediction, thermal management, etc. This paper presents a Foster-type equivalent transient thermal model developed through finite element simulations for a commercial Si IGBT power module. Such thermal models can easily merge into circuit simulation programs and even can be employed as real-time temperature estimators. However, fixed thermal models may give large errors in different operating conditions. In addition, they become unable to satisfactorily estimate temperatures over time, because of the thermal aging phenomenon. Thus, in this study, the thermal model of the power module is developed to be adapted to different boundary conditions - ambient temperature, and cooling system – as well as thermal aging of solder joints, which is the most common failure in the power modules. Also, the thermal model features the effect of power loss, and the cross-coupling effect among nearby semiconductor dies. Comparisons with FEM verify the performance of the studied thermal model.
Original languageEnglish
Title of host publicationProceedings of 2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)
Number of pages10
PublisherIEEE
Publication date30 Oct 2018
Pages1-10
Article number8515416
ISBN (Print)978-1-5386-4145-3
ISBN (Electronic)978-9-0758-1528-3
Publication statusPublished - 30 Oct 2018
Event20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe) - Riga, Latvia
Duration: 17 Sep 201821 Sep 2018

Conference

Conference20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)
CountryLatvia
CityRiga
Period17/09/201821/09/2018

Fingerprint

Aging of materials
Thermal aging
Hot Temperature
Circuit simulation
Insulated gate bipolar transistors (IGBT)
Semiconductor devices
Power electronics
Cooling systems
Temperature control
Soldering alloys
Temperature
Boundary conditions
Semiconductor materials
Finite element method

Keywords

  • Device modeling
  • IGBT
  • Reliability
  • Semiconductor device
  • Thermal stress

Cite this

Akbari, M., Bahman, A. S., Tavakoli Bina, M., Eskandari, B., Iannuzzo, F., & Blaabjerg, F. (2018). A Multi-Layer RC Thermal Model for Power Modules Adaptable to Different Operating Conditions and Aging. In Proceedings of 2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe) (pp. 1-10). [8515416] IEEE.
Akbari, Mohsen ; Bahman, Amir Sajjad ; Tavakoli Bina, Mohammad ; Eskandari, Bahman ; Iannuzzo, Francesco ; Blaabjerg, Frede. / A Multi-Layer RC Thermal Model for Power Modules Adaptable to Different Operating Conditions and Aging. Proceedings of 2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe). IEEE, 2018. pp. 1-10
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abstract = "Semiconductor devices are often the most vulnerable components of power electronics converters among which thermal failures are the most likely ones. Thus, more accurate but straightforward thermal models are needed to efficiently do actions such as lifetime prediction, thermal management, etc. This paper presents a Foster-type equivalent transient thermal model developed through finite element simulations for a commercial Si IGBT power module. Such thermal models can easily merge into circuit simulation programs and even can be employed as real-time temperature estimators. However, fixed thermal models may give large errors in different operating conditions. In addition, they become unable to satisfactorily estimate temperatures over time, because of the thermal aging phenomenon. Thus, in this study, the thermal model of the power module is developed to be adapted to different boundary conditions - ambient temperature, and cooling system – as well as thermal aging of solder joints, which is the most common failure in the power modules. Also, the thermal model features the effect of power loss, and the cross-coupling effect among nearby semiconductor dies. Comparisons with FEM verify the performance of the studied thermal model.",
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Akbari, M, Bahman, AS, Tavakoli Bina, M, Eskandari, B, Iannuzzo, F & Blaabjerg, F 2018, A Multi-Layer RC Thermal Model for Power Modules Adaptable to Different Operating Conditions and Aging. in Proceedings of 2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)., 8515416, IEEE, pp. 1-10, 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe), Riga, Latvia, 17/09/2018.

A Multi-Layer RC Thermal Model for Power Modules Adaptable to Different Operating Conditions and Aging. / Akbari, Mohsen; Bahman, Amir Sajjad; Tavakoli Bina, Mohammad; Eskandari, Bahman; Iannuzzo, Francesco; Blaabjerg, Frede.

Proceedings of 2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe). IEEE, 2018. p. 1-10 8515416.

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

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T1 - A Multi-Layer RC Thermal Model for Power Modules Adaptable to Different Operating Conditions and Aging

AU - Akbari, Mohsen

AU - Bahman, Amir Sajjad

AU - Tavakoli Bina, Mohammad

AU - Eskandari, Bahman

AU - Iannuzzo, Francesco

AU - Blaabjerg, Frede

PY - 2018/10/30

Y1 - 2018/10/30

N2 - Semiconductor devices are often the most vulnerable components of power electronics converters among which thermal failures are the most likely ones. Thus, more accurate but straightforward thermal models are needed to efficiently do actions such as lifetime prediction, thermal management, etc. This paper presents a Foster-type equivalent transient thermal model developed through finite element simulations for a commercial Si IGBT power module. Such thermal models can easily merge into circuit simulation programs and even can be employed as real-time temperature estimators. However, fixed thermal models may give large errors in different operating conditions. In addition, they become unable to satisfactorily estimate temperatures over time, because of the thermal aging phenomenon. Thus, in this study, the thermal model of the power module is developed to be adapted to different boundary conditions - ambient temperature, and cooling system – as well as thermal aging of solder joints, which is the most common failure in the power modules. Also, the thermal model features the effect of power loss, and the cross-coupling effect among nearby semiconductor dies. Comparisons with FEM verify the performance of the studied thermal model.

AB - Semiconductor devices are often the most vulnerable components of power electronics converters among which thermal failures are the most likely ones. Thus, more accurate but straightforward thermal models are needed to efficiently do actions such as lifetime prediction, thermal management, etc. This paper presents a Foster-type equivalent transient thermal model developed through finite element simulations for a commercial Si IGBT power module. Such thermal models can easily merge into circuit simulation programs and even can be employed as real-time temperature estimators. However, fixed thermal models may give large errors in different operating conditions. In addition, they become unable to satisfactorily estimate temperatures over time, because of the thermal aging phenomenon. Thus, in this study, the thermal model of the power module is developed to be adapted to different boundary conditions - ambient temperature, and cooling system – as well as thermal aging of solder joints, which is the most common failure in the power modules. Also, the thermal model features the effect of power loss, and the cross-coupling effect among nearby semiconductor dies. Comparisons with FEM verify the performance of the studied thermal model.

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Akbari M, Bahman AS, Tavakoli Bina M, Eskandari B, Iannuzzo F, Blaabjerg F. A Multi-Layer RC Thermal Model for Power Modules Adaptable to Different Operating Conditions and Aging. In Proceedings of 2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe). IEEE. 2018. p. 1-10. 8515416