A Review: New Designs of Heat Sinks for Flow Boiling Cooling

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2 Citations (Scopus)

Abstract

This paper presents a state-of-the-art review on heat sinks configurations used in flow boiling to cool electronic components. Two phase cooling methods and in this case using them in channels have disadvantages including complexities in flow field and instabities. The major role of designs of flow boiling heat sinks is to mitigate or delay these instabilities to reach stable and high performance cooling from heat transfer and pressure drop point of views. First, these instabilities in heat sinks with two phase coolants and phenomena leading to them are briefed. Then studies on presenting modifications and new designs of flow boiling heat sinks are reviewed. Description for five instabilities, three modifications and five heat sink configuration are addressed. It shows the highest cooling performance belongs to manifold microchannel and the piranha pin fin microstructure heat sinks.
Original languageEnglish
Title of host publicationProceedings of 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Number of pages6
PublisherIEEE
Publication dateSep 2019
Article number8923505
ISBN (Electronic)978-1-7281-2078-2
DOIs
Publication statusPublished - Sep 2019
Event 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy
Duration: 25 Sep 201927 Sep 2019

Conference

Conference 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
CountryItaly
CityLecco
Period25/09/201927/09/2019
SeriesInternational Workshop on Thermal Investigations of ICs and Systems
ISSN2474-1515

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