Projects per year
Abstract
Thermal impedance of IGBT modules may vary with operating conditions due to that the thermal conductivity and heat capacity of materials are temperature dependent. This paper proposes a Cauer thermal model for a 1700 V/1000 A IGBT module with temperature-dependent thermal resistances and thermal capacitances. The temperature effect is investigated by Finite Element Method (FEM) simulation based on the geometry and material information of the IGBT module. The developed model is ready for circuit-level simulation to achieve an improved accuracy of the estimation on IGBT junction temperature and its relevant reliability aspect performance. A test bench is built up with an ultra-fast infrared (IR) camera to validate the proposed thermal impedance model.
Original language | English |
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Title of host publication | Proceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE) |
Number of pages | 8 |
Publisher | IEEE Press |
Publication date | Sept 2014 |
Pages | 2901-2908 |
ISBN (Print) | 978-1-4799-5776-7 |
DOIs | |
Publication status | Published - Sept 2014 |
Event | 2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Pittsburgh, Pittsburgh, United States Duration: 14 Sept 2014 → 18 Sept 2014 |
Conference
Conference | 2014 IEEE Energy Conversion Congress and Exposition (ECCE) |
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Location | Pittsburgh |
Country/Territory | United States |
City | Pittsburgh |
Period | 14/09/2014 → 18/09/2014 |
Fingerprint
Dive into the research topics of 'A Temperature-Dependent Thermal Model of IGBT Modules Suitable for Circuit-Level Simulations'. Together they form a unique fingerprint.Projects
- 1 Finished
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Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Project: Research
Activities
- 1 Conference presentations
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2014 IEEE Energy Conversion Congress and Exposition (ECCE)
Huai Wang (Speaker)
14 Sept 2014 → 19 Sept 2014Activity: Talks and presentations › Conference presentations