A Viable Mission Profile Emulator for Power Modules in Modular Multilevel Converters

Various methods have been presented in the past to emulate the electrical behavior of modular multilevel converters (MMCs). To meet the demands for the reliability aspect study of MMCs, this paper proposes a viable setup to emulate the thermal behavior and to investigate its feasibility for reliability testing and thermal model validation of the power modules in the MMC. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profile as a full-scale MMC; and 3) having significantly reduced requirement for dc power supply compared to existing setups used for electrical studies. Theoretical discussions, and simulations as well as the experimental results are presented to demonstrate the capability of the mission profile emulator both electrically and thermally. Moreover, this paper is accompanied by a video demonstrating how to measure the junction temperature of the power devices using the optical fiber and the thermal camera.