Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA

Rishita Saini, Neha Bansal, Meenakshi Bansal, Lakshay Kalra, Preet Mohan Singh, Bishwajeet Pandey, Dil Muhammad Akbar Hussain

Research output: Contribution to journalConference article in JournalResearchpeer-review

Abstract

Thermal aware design is currently gaining importance in VLSI research domain. In this work, we are going to design thermal aware energy efficient ROM on Virtex-5 FPGA. Ambient Temperature, airflow, and heat sink profile play a significant role in thermal aware hardware design life cycle. Ambient temperature is a temperature of surroundings. Airflow is measured in Linear Feet per Minute (LFM). Medium profile and high profile are two different heat sink profile available in XPower analyzer.When frequency goes from 4.0GHz to 1.0GHz, there is 21.8% reduction in clock power, 75% reduction in I/O Power, 35.6% reduction in leakage power and 53.8% reduction in total power at the same frequency.
Original languageEnglish
JournalAdvanced Materials Research
Volume1082
Pages (from-to)467-470
Number of pages4
ISSN1022-6680
Publication statusPublished - Feb 2015
Event4th International Conference on Advanced Materials and Engineering Materials, ICAMEM 2014 - Hong Kong, Hong Kong
Duration: 19 Oct 201420 Oct 2014

Conference

Conference4th International Conference on Advanced Materials and Engineering Materials, ICAMEM 2014
CountryHong Kong
CityHong Kong
Period19/10/201420/10/2014

Fingerprint

ROM
Field programmable gate arrays (FPGA)
Heat sinks
Temperature
Life cycle
Clocks
Hardware
Hot Temperature

Keywords

  • Junction Temperature
  • Ambient Temperature
  • Leakage Power
  • Clock Power
  • I/O Power
  • Total Power
  • ROM
  • Energy Efficient

Cite this

Saini, R., Bansal, N., Bansal, M., Kalra, L., Singh, P. M., Pandey, B., & Hussain, D. M. A. (2015). Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA. Advanced Materials Research, 1082, 467-470.
Saini, Rishita ; Bansal, Neha ; Bansal, Meenakshi ; Kalra, Lakshay ; Singh, Preet Mohan ; Pandey, Bishwajeet ; Hussain, Dil Muhammad Akbar. / Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA. In: Advanced Materials Research. 2015 ; Vol. 1082. pp. 467-470.
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abstract = "Thermal aware design is currently gaining importance in VLSI research domain. In this work, we are going to design thermal aware energy efficient ROM on Virtex-5 FPGA. Ambient Temperature, airflow, and heat sink profile play a significant role in thermal aware hardware design life cycle. Ambient temperature is a temperature of surroundings. Airflow is measured in Linear Feet per Minute (LFM). Medium profile and high profile are two different heat sink profile available in XPower analyzer.When frequency goes from 4.0GHz to 1.0GHz, there is 21.8{\%} reduction in clock power, 75{\%} reduction in I/O Power, 35.6{\%} reduction in leakage power and 53.8{\%} reduction in total power at the same frequency.",
keywords = "Junction Temperature, Ambient Temperature, Leakage Power, Clock Power, I/O Power, Total Power, ROM, Energy Efficient",
author = "Rishita Saini and Neha Bansal and Meenakshi Bansal and Lakshay Kalra and Singh, {Preet Mohan} and Bishwajeet Pandey and Hussain, {Dil Muhammad Akbar}",
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Saini, R, Bansal, N, Bansal, M, Kalra, L, Singh, PM, Pandey, B & Hussain, DMA 2015, 'Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA', Advanced Materials Research, vol. 1082, pp. 467-470.

Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA. / Saini, Rishita; Bansal, Neha; Bansal, Meenakshi; Kalra, Lakshay; Singh, Preet Mohan; Pandey, Bishwajeet; Hussain, Dil Muhammad Akbar.

In: Advanced Materials Research, Vol. 1082, 02.2015, p. 467-470.

Research output: Contribution to journalConference article in JournalResearchpeer-review

TY - GEN

T1 - Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA

AU - Saini, Rishita

AU - Bansal, Neha

AU - Bansal, Meenakshi

AU - Kalra, Lakshay

AU - Singh, Preet Mohan

AU - Pandey, Bishwajeet

AU - Hussain, Dil Muhammad Akbar

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AB - Thermal aware design is currently gaining importance in VLSI research domain. In this work, we are going to design thermal aware energy efficient ROM on Virtex-5 FPGA. Ambient Temperature, airflow, and heat sink profile play a significant role in thermal aware hardware design life cycle. Ambient temperature is a temperature of surroundings. Airflow is measured in Linear Feet per Minute (LFM). Medium profile and high profile are two different heat sink profile available in XPower analyzer.When frequency goes from 4.0GHz to 1.0GHz, there is 21.8% reduction in clock power, 75% reduction in I/O Power, 35.6% reduction in leakage power and 53.8% reduction in total power at the same frequency.

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KW - Total Power

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Saini R, Bansal N, Bansal M, Kalra L, Singh PM, Pandey B et al. Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA. Advanced Materials Research. 2015 Feb;1082:467-470.