An Analytical Model for Spectral Peak Frequency Prediction of Substrate Noise in CMOS Substrates

Ming Shen; Jan H. Mikkelsen

doi:10.1109/NORCHIP.2013.6701999

An Analytical Model for Spectral Peak Frequency Prediction of Substrate Noise in CMOS Substrates

Department of Electronic Systems

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Abstract

This paper proposes an analytical model describing the generation of switching current noise in CMOS substrates. The model eliminates the need for SPICE simulations in existing methods by conducting a transient analysis on a generic CMOS inverter and approximating the switching current waveform us- ing a Modified Raised Cosine (MORAC) equation. The proposed model is scalable, easy to implement and capable of predicting the spectral peak frequency of the substrate noise. The validation has been done via simulations and measurements. Good agreement has been found between the modeled and the measured results.

Original language	English
Title of host publication	IEEE Norchip, 2013
Number of pages	4
Publisher	IEEE (Institute of Electrical and Electronics Engineers)
Publication date	2013
ISBN (Electronic)	978-1-4799-1647-4
DOIs	https://doi.org/10.1109/NORCHIP.2013.6701999
Publication status	Published - 2013
Event	IEEE 31st NORCHIP conference - Vilnius, Lithuania Duration: 11 Nov 2013 → 12 Nov 2013

Conference

Conference	IEEE 31st NORCHIP conference
Country/Territory	Lithuania
City	Vilnius
Period	11/11/2013 → 12/11/2013

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10.1109/NORCHIP.2013.6701999

An Analytical Model for Spectral Peak Frequency Prediction of Substrate Noise in CMOS SubstratesAccepted author manuscript, 2.05 MB

http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6701999

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Microwatt Radio for Self-Sustaining Wireless Sensor Networks
Shen, M. (Project Participant) & Mikkelsen, J. H. (Project Participant)
The Danish Council for Independent Research, Technology and Production Sciences. Individual Post-doc
01/01/2011 → 30/04/2014
Project: Research

Cite this

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title = "An Analytical Model for Spectral Peak Frequency Prediction of Substrate Noise in CMOS Substrates",

abstract = "This paper proposes an analytical model describing the generation of switching current noise in CMOS substrates. The model eliminates the need for SPICE simulations in existing methods by conducting a transient analysis on a generic CMOS inverter and approximating the switching current waveform us- ing a Modified Raised Cosine (MORAC) equation. The proposed model is scalable, easy to implement and capable of predicting the spectral peak frequency of the substrate noise. The validation has been done via simulations and measurements. Good agreement has been found between the modeled and the measured results.",

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AB - This paper proposes an analytical model describing the generation of switching current noise in CMOS substrates. The model eliminates the need for SPICE simulations in existing methods by conducting a transient analysis on a generic CMOS inverter and approximating the switching current waveform us- ing a Modified Raised Cosine (MORAC) equation. The proposed model is scalable, easy to implement and capable of predicting the spectral peak frequency of the substrate noise. The validation has been done via simulations and measurements. Good agreement has been found between the modeled and the measured results.

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T2 - IEEE 31st NORCHIP conference

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An Analytical Model for Spectral Peak Frequency Prediction of Substrate Noise in CMOS Substrates

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Microwatt Radio for Self-Sustaining Wireless Sensor Networks

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