Projects per year
Abstract
Thermal interface materials (TIMs) contribute to a considerable part of thermal resistance from junction to ambient in power modules, which is an important design variable affecting the thermal loading and reliability performance. Nevertheless, the existing standard characterization methods for TIMs may not represent the realistic conditions in power module applications. Physical thermal models for TIMs are of high complexity, which is not always convenient enough to apply in engineering design. This paper proposes an empirical model for TIMs based on physical understandings and experimental characterizations under more realistic conditions. The proposed model includes two variables only, the initial thickness and screw torque. It retains the advantages in terms of accuracy and convenience in use. A realistic power electronic converter based experimental platform has been built and comprehensive experimental results have been conducted on a 1200 V/50 A IGBT module.
Original language | English |
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Journal | Microelectronics Reliability |
Volume | 88-90 |
Pages (from-to) | 806-811 |
Number of pages | 6 |
ISSN | 0026-2714 |
DOIs | |
Publication status | Published - Sept 2018 |
Event | 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - AKKC, Aalborg, Denmark Duration: 1 Oct 2018 → 5 Oct 2018 Conference number: 29th http://www.esref2018conf.org/ |
Conference
Conference | 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis |
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Number | 29th |
Location | AKKC |
Country/Territory | Denmark |
City | Aalborg |
Period | 01/10/2018 → 05/10/2018 |
Internet address |
Fingerprint
Dive into the research topics of 'An empirical model for thermal interface materials based on experimental characterizations under realistic conditions'. Together they form a unique fingerprint.Projects
- 1 Finished
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Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F. (PI), Munk-Nielsen, S. (Project Participant), Pedersen, K. (Project Participant) & Popok, V. (Project Participant)
01/04/2011 → 31/12/2016
Project: Research
Activities
- 1 Conference organisation or participation
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29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Wang, Z. (Participant)
1 Oct 2018 → 5 Oct 2018Activity: Attending an event › Conference organisation or participation
Research output
- 1 PhD thesis
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Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters
Wang, Z., 2019, Aalborg Universitetsforlag. 111 p.Research output: PhD thesis
Open AccessFile