An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

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Abstract

Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT model. A study case on a 1700 V/1000 A IGBT module demonstrates the effectiveness of the proposed simulation method.
Original languageEnglish
Title of host publicationProceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE)
Number of pages8
PublisherIEEE Press
Publication dateSep 2014
Pages5502-5509
ISBN (Print)978-1-4799-5776-7
DOIs
Publication statusPublished - Sep 2014
Event2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Pittsburgh, Pittsburgh, United States
Duration: 14 Sep 201418 Sep 2014

Conference

Conference2014 IEEE Energy Conversion Congress and Exposition (ECCE)
LocationPittsburgh
CountryUnited States
CityPittsburgh
Period14/09/201418/09/2014

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