Projects per year
Abstract
Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT model. A study case on a 1700 V/1000 A IGBT module demonstrates the effectiveness of the proposed simulation method.
Original language | English |
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Title of host publication | Proceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE) |
Number of pages | 8 |
Publisher | IEEE Press |
Publication date | Sept 2014 |
Pages | 5502-5509 |
ISBN (Print) | 978-1-4799-5776-7 |
DOIs | |
Publication status | Published - Sept 2014 |
Event | 2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Pittsburgh, Pittsburgh, United States Duration: 14 Sept 2014 → 18 Sept 2014 |
Conference
Conference | 2014 IEEE Energy Conversion Congress and Exposition (ECCE) |
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Location | Pittsburgh |
Country/Territory | United States |
City | Pittsburgh |
Period | 14/09/2014 → 18/09/2014 |
Fingerprint
Dive into the research topics of 'An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit'. Together they form a unique fingerprint.Projects
- 1 Finished
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Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Project: Research
Activities
- 1 Conference presentations
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2014 IEEE Energy Conversion Congress and Exposition (ECCE)
Huai Wang (Speaker)
14 Sept 2014 → 19 Sept 2014Activity: Talks and presentations › Conference presentations