An On-line Calibration Method for TSEP-based Junction Temperature Estimation

Yingzhou Peng, Qian Wang*, Haoran Wang, Huai Wang

*Corresponding author for this work

Research output: Contribution to journalJournal articleResearchpeer-review

1 Citation (Scopus)
128 Downloads (Pure)


Temperature sensitive electrical parameters (TSEP) provide an indirect and noninvasive method for on-line junction temperature estimation of power semiconductor devices. It is known that the fundamental of TSEP-based methods is to calibrate the relationship between TSEP and junction temperature in advance. However, the calibration methods in the literature need to open the module, require pretesting, or record the operating data of a converter in the entire power rating range, which are inconvenient in field applications. This article proposes an on-line and noninvasive calibration method by measuring the data at three operating states that are already existed in the regular converter operation. It is achieved by measuring the accessible heatsink/case temperature and TSEP during converter regular operation. The concept, implementation, and error analysis of the proposed method are presented in this article. Experimental verification is given to prove the effectiveness, accuracy, and convenience of the proposed method.

Original languageEnglish
JournalI E E E Transactions on Industrial Electronics
Issue number12
Pages (from-to)13616-13624
Number of pages9
Publication statusPublished - 1 Dec 2022


  • Calibration
  • Estimation
  • Index terms-Power semiconductor
  • Junctions
  • Temperature distribution
  • Temperature measurement
  • Thermal resistance
  • Voltage measurement
  • condition monitoring
  • junction temperature
  • power converter


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