Analysis of the Influence of the Bottom-layer Copper in Direct-Bond Copper Substrate on its Overall Electric Field and Partial Discharge Performance

Yuan Gao; Thore Stig Aunsborg; Kai Yin; Claus Leth Bak; Hongbo Zhao; zichen zhang; Stig Munk-Nielsen; Christian Uhrenfeldt

Analysis of the Influence of the Bottom-layer Copper in Direct-Bond Copper Substrate on its Overall Electric Field and Partial Discharge Performance

Yuan Gao, Thore Stig Aunsborg, Kai Yin, Claus Leth Bak, Hongbo Zhao, zichen zhang, Stig Munk-Nielsen, Christian Uhrenfeldt

Research output: Contribution to conference without publisher/journal › Paper without publisher/journal › Research

Original language	English
Publication date	17 Apr 2023
Number of pages	4
Publication status	In preparation - 17 Apr 2023

Cite this

@conference{8987d62abae64f69b373d74e75e97352,

title = "Analysis of the Influence of the Bottom-layer Copper in Direct-Bond Copper Substrate on its Overall Electric Field and Partial Discharge Performance",

author = "Yuan Gao and Aunsborg, {Thore Stig} and Kai Yin and Bak, {Claus Leth} and Hongbo Zhao and zichen zhang and Stig Munk-Nielsen and Christian Uhrenfeldt",

year = "2023",

month = apr,

day = "17",

language = "English",

}

TY - CONF

T1 - Analysis of the Influence of the Bottom-layer Copper in Direct-Bond Copper Substrate on its Overall Electric Field and Partial Discharge Performance

AU - Gao, Yuan

AU - Aunsborg, Thore Stig

AU - Yin, Kai

AU - Bak, Claus Leth

AU - Zhao, Hongbo

AU - zhang, zichen

AU - Munk-Nielsen, Stig

AU - Uhrenfeldt, Christian

PY - 2023/4/17

Y1 - 2023/4/17

M3 - Paper without publisher/journal

ER -