Abstract

This letter studies the influence of the bottom-layer copper of the direct-bond copper (DBC) on the electric field distribution. DBC samples with various layouts were designed, and the partial discharge (PD) test platform was built according to standard IEC 60270 to test the partial discharge inception votage (PDIV) of the samples. The finite element simulation model was built to analyze the electric field distribution of all samples. The results showed that the electric field of triple point of DBC was greatly reduced by floating the bottom-layer coppor, or removing part or all of the bottom-layer copper. The electric filed simulation results show good agreement with the PD experimental measurements.
Original languageEnglish
JournalI E E E Power Electronics Letters
Number of pages4
ISSN1540-7985
Publication statusSubmitted - 2024

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