TY - JOUR
T1 - Analysis of the Influence of the Bottom-layer Copper in Direct-Bond Copper Substrate on its Overall Electric Field and Partial Discharge Performance
AU - Gao, Yuan
AU - Aunsborg, Thore Stig
AU - Yin, Kai
AU - Bak, Claus Leth
AU - Zhao, Hongbo
AU - zhang, zichen
AU - Munk-Nielsen, Stig
AU - Uhrenfeldt, Christian
PY - 2024
Y1 - 2024
N2 - This letter studies the influence of the bottom-layer copper of the direct-bond copper (DBC) on the electric field distribution. DBC samples with various layouts were designed, and the partial discharge (PD) test platform was built according to standard IEC 60270 to test the partial discharge inception votage (PDIV) of the samples. The finite element simulation model was built to analyze the electric field distribution of all samples. The results showed that the electric field of triple point of DBC was greatly reduced by floating the bottom-layer coppor, or removing part or all of the bottom-layer copper. The electric filed simulation results show good agreement with the PD experimental measurements.
AB - This letter studies the influence of the bottom-layer copper of the direct-bond copper (DBC) on the electric field distribution. DBC samples with various layouts were designed, and the partial discharge (PD) test platform was built according to standard IEC 60270 to test the partial discharge inception votage (PDIV) of the samples. The finite element simulation model was built to analyze the electric field distribution of all samples. The results showed that the electric field of triple point of DBC was greatly reduced by floating the bottom-layer coppor, or removing part or all of the bottom-layer copper. The electric filed simulation results show good agreement with the PD experimental measurements.
M3 - Letter
SN - 1540-7985
JO - I E E E Power Electronics Letters
JF - I E E E Power Electronics Letters
ER -