TY - JOUR
T1 - Analytical and Experimental Investigation on A Dynamic Thermo-Sensitive Electrical Parameter with Maximum dIC/dt during Turn-off for High Power Trench Gate/Field-Stop IGBT Modules
AU - Chen, Yuxiang
AU - Luo, Haoze
AU - Li, Wuhua
AU - He, Xiangning
AU - Iannuzzo, Francesco
AU - Blaabjerg, Frede
PY - 2017/8
Y1 - 2017/8
N2 - In this paper, a dynamic thermo-sensitive electrical parameter (DTSEP) for extracting the junction temperature of the trench gate/field-stop insulated gate bipolar transistor (IGBT) modules by using the maximum collector current falling rate is proposed. First, a theoretical model of the transient collector current during turn-off process is developed in terms of the behavior characteristics of the inside storage carriers. Then, the inherent linear relationship between the maximum collector current falling rate dI{C}/dt and junction temperature T {j} is demonstrated and investigated. Fortunately, benefitting from the presence of the intrinsic parasitic inductance L{rm eE} between the Kelvin and power emitters of IGBT modules, the maximum dI{C}/dt can be easily measured to validate the theoretical analysis. Consequently, the maximum dI{C}/dt during turn-off process is a promising DTSEP for IGBT module junction temperature estimation. Moreover, the physical device parameters that affect the temperature sensitivity of the maximum dI{C}/dt are also discussed with the derived transient collector current falling model.
AB - In this paper, a dynamic thermo-sensitive electrical parameter (DTSEP) for extracting the junction temperature of the trench gate/field-stop insulated gate bipolar transistor (IGBT) modules by using the maximum collector current falling rate is proposed. First, a theoretical model of the transient collector current during turn-off process is developed in terms of the behavior characteristics of the inside storage carriers. Then, the inherent linear relationship between the maximum collector current falling rate dI{C}/dt and junction temperature T {j} is demonstrated and investigated. Fortunately, benefitting from the presence of the intrinsic parasitic inductance L{rm eE} between the Kelvin and power emitters of IGBT modules, the maximum dI{C}/dt can be easily measured to validate the theoretical analysis. Consequently, the maximum dI{C}/dt during turn-off process is a promising DTSEP for IGBT module junction temperature estimation. Moreover, the physical device parameters that affect the temperature sensitivity of the maximum dI{C}/dt are also discussed with the derived transient collector current falling model.
KW - Dynamic thermo-sensitive electrical parameter (DTSEP)
KW - High power trench gate/field-stop IGBTs
KW - Maximum collector current falling rate
KW - Storage carrier behaviors
UR - http://www.scopus.com/inward/record.url?scp=85017606816&partnerID=8YFLogxK
U2 - 10.1109/TPEL.2016.2619620
DO - 10.1109/TPEL.2016.2619620
M3 - Journal article
AN - SCOPUS:85017606816
SN - 0885-8993
VL - 32
SP - 6394
EP - 6404
JO - IEEE Transactions on Power Electronics
JF - IEEE Transactions on Power Electronics
IS - 8
M1 - 7604096
ER -