Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters

Zhongxu Wang; Huai Wang; Yi Zhang; Frede Blaabjerg

doi:10.23919/IPEC.2018.8507731

Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters

Zhongxu Wang, Huai Wang, Yi Zhang, Frede Blaabjerg

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

19 Citations (Scopus)

326 Downloads (Pure)

Abstract

Due to the parameter mismatch, the unbalanced power loss distribution among SMs in the modular multilevel converter (MMC) can be introduced and further deteriorated by the low-frequency asynchronous switching transients related to no-carrier modulation techniques. The unbalanced thermal stress can reduce the reliability of the MMC and increase the complexity of cooling system design. Nevertheless, an internal balance mechanism exists in the MMC thanks to the capacitor voltage balancing. It contributes to an even conduction loss dissipation among SMs, which is studied and revealed in this paper. Moreover, a computationally light conduction loss estimation method is proposed correspondingly relying on the characteristics of semiconductors and the arm current only. Simulations and experiments are conducted to verify the effectiveness the proposed method.

Original language	English
Title of host publication	2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
Number of pages	6
Publisher	IEEE Press
Publication date	22 Oct 2018
Pages	3123-3128
Article number	8507731
ISBN (Print)	978-1-5386-4190-3
ISBN (Electronic)	978-4-88686-405-5
DOIs	https://doi.org/10.23919/IPEC.2018.8507731
Publication status	Published - 22 Oct 2018
Event	8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018 - Niigata, Japan Duration: 20 May 2018 → 24 May 2018

Conference

Conference	8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
Country/Territory	Japan
City	Niigata
Period	20/05/2018 → 24/05/2018
Sponsor	IEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), IEEJ Industry Applications Society (IAS)

Keywords

balanced conduction loss distribution
conduction loss estimation
Modular multilevel converter (MMC)
semiconductor

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10.23919/IPEC.2018.8507731

Balanced Conduction Loss Distribution among SMs in Modular Multilevel ConvertersAccepted author manuscript, 2.04 MB

https://www.scopus.com/record/display.uri?eid=2-s2.0-85057344160&origin=inward&txGid=08fc81252e664a5d7565c99783e0358e

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Cite this

@inproceedings{db85a1278ce84d40a65d1f0413145d34,

title = "Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters",

abstract = "Due to the parameter mismatch, the unbalanced power loss distribution among SMs in the modular multilevel converter (MMC) can be introduced and further deteriorated by the low-frequency asynchronous switching transients related to no-carrier modulation techniques. The unbalanced thermal stress can reduce the reliability of the MMC and increase the complexity of cooling system design. Nevertheless, an internal balance mechanism exists in the MMC thanks to the capacitor voltage balancing. It contributes to an even conduction loss dissipation among SMs, which is studied and revealed in this paper. Moreover, a computationally light conduction loss estimation method is proposed correspondingly relying on the characteristics of semiconductors and the arm current only. Simulations and experiments are conducted to verify the effectiveness the proposed method.",

keywords = "balanced conduction loss distribution, conduction loss estimation, Modular multilevel converter (MMC), semiconductor",

author = "Zhongxu Wang and Huai Wang and Yi Zhang and Frede Blaabjerg",

year = "2018",

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day = "22",

doi = "10.23919/IPEC.2018.8507731",

language = "English",

isbn = "978-1-5386-4190-3",

pages = "3123--3128",

booktitle = "2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018",

publisher = "IEEE Press",

note = "8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018 ; Conference date: 20-05-2018 Through 24-05-2018",

}

Wang, Z, Wang, H , Zhang, Y & Blaabjerg, F 2018, Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters. in 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018., 8507731, IEEE Press, pp. 3123-3128, 8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018, Niigata, Japan, 20/05/2018. https://doi.org/10.23919/IPEC.2018.8507731

Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters. / Wang, Zhongxu; Wang, Huai ; Zhang, Yi et al.
2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018. IEEE Press, 2018. p. 3123-3128 8507731.

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters

AU - Wang, Zhongxu

AU - Wang, Huai

AU - Zhang, Yi

AU - Blaabjerg, Frede

PY - 2018/10/22

Y1 - 2018/10/22

N2 - Due to the parameter mismatch, the unbalanced power loss distribution among SMs in the modular multilevel converter (MMC) can be introduced and further deteriorated by the low-frequency asynchronous switching transients related to no-carrier modulation techniques. The unbalanced thermal stress can reduce the reliability of the MMC and increase the complexity of cooling system design. Nevertheless, an internal balance mechanism exists in the MMC thanks to the capacitor voltage balancing. It contributes to an even conduction loss dissipation among SMs, which is studied and revealed in this paper. Moreover, a computationally light conduction loss estimation method is proposed correspondingly relying on the characteristics of semiconductors and the arm current only. Simulations and experiments are conducted to verify the effectiveness the proposed method.

AB - Due to the parameter mismatch, the unbalanced power loss distribution among SMs in the modular multilevel converter (MMC) can be introduced and further deteriorated by the low-frequency asynchronous switching transients related to no-carrier modulation techniques. The unbalanced thermal stress can reduce the reliability of the MMC and increase the complexity of cooling system design. Nevertheless, an internal balance mechanism exists in the MMC thanks to the capacitor voltage balancing. It contributes to an even conduction loss dissipation among SMs, which is studied and revealed in this paper. Moreover, a computationally light conduction loss estimation method is proposed correspondingly relying on the characteristics of semiconductors and the arm current only. Simulations and experiments are conducted to verify the effectiveness the proposed method.

KW - balanced conduction loss distribution

KW - conduction loss estimation

KW - Modular multilevel converter (MMC)

KW - semiconductor

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DO - 10.23919/IPEC.2018.8507731

M3 - Article in proceeding

SN - 978-1-5386-4190-3

SP - 3123

EP - 3128

BT - 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018

PB - IEEE Press

T2 - 8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018

Y2 - 20 May 2018 through 24 May 2018

ER -

Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters

Abstract

Conference

Keywords

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AUB Link

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Center Of Reliable Power Electronics (CORPE)

the International Power Electronics Conference, IPEC-Niigata 2018 -ECCE Asia

Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters

Cite this

Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters

Abstract

Conference

Keywords

Access to Document

AUB Link

Other files and links

Fingerprint

Projects

Center Of Reliable Power Electronics (CORPE)

Activities

the International Power Electronics Conference, IPEC-Niigata 2018 -ECCE Asia

Research output

Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters

Cite this