Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling

Asger Bjørn Jørgensen; Szymon Beczkowski; Benjamin Futtrup Kjærsgaard; Thore Stig Aunsborg; Stig Munk-Nielsen; Hongbo Zhao

doi:10.23919/EPE23ECCEEurope58414.2023.10264666

Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling

Asger Bjørn Jørgensen^*, Szymon Beczkowski, Benjamin Futtrup Kjærsgaard, Thore Stig Aunsborg, Stig Munk-Nielsen, Hongbo Zhao

^*Corresponding author for this work

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

3 Citations (Scopus)

412 Downloads (Pure)

Abstract

A 3D printed ceramic baseplate-less power module structure with integrated micro-channels for liquid cooling is presented. The main benefit is that parasitic capacitive couplings are removed in comparison with conventional power module packaging. Switching waveforms at 60 kV/us exhibit limited overshoot while good thermal performance is maintained.

Original language	English
Title of host publication	2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe
Number of pages	6
Publisher	IEEE (Institute of Electrical and Electronics Engineers)
Publication date	4 Sept 2023
Article number	10264666
ISBN (Print)	979-8-3503-1678-0
ISBN (Electronic)	978-9-0758-1541-2
DOIs	https://doi.org/10.23919/EPE23ECCEEurope58414.2023.10264666
Publication status	Published - 4 Sept 2023
Event	2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) - Aalborg, Denmark Duration: 4 Sept 2023 → 8 Sept 2023

Conference

Conference	2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)
Country/Territory	Denmark
City	Aalborg
Period	04/09/2023 → 08/09/2023

Keywords

Additive manufacturing
Packaging
Parasitic elements
SiC MOSFET
Thermal management

Access to Document

10.23919/EPE23ECCEEurope58414.2023.10264666

epe23_ceramicmodule_PDFAAccepted author manuscript, 4.24 MB

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Jørgensen, A. B., Beczkowski, S., Kjærsgaard, B. F., Aunsborg, T. S., Munk-Nielsen, S., & Zhao, H. (2023). Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling. In 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe Article 10264666 IEEE (Institute of Electrical and Electronics Engineers). https://doi.org/10.23919/EPE23ECCEEurope58414.2023.10264666

@inproceedings{cb7832108a114a43b3aea645c6812eaf,

title = "Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling",

abstract = "A 3D printed ceramic baseplate-less power module structure with integrated micro-channels for liquid cooling is presented. The main benefit is that parasitic capacitive couplings are removed in comparison with conventional power module packaging. Switching waveforms at 60 kV/us exhibit limited overshoot while good thermal performance is maintained.",

keywords = "Additive manufacturing, Packaging, Parasitic elements, SiC MOSFET, Thermal management",

author = "J{\o}rgensen, {Asger Bj{\o}rn} and Szymon Beczkowski and Kj{\ae}rsgaard, {Benjamin Futtrup} and Aunsborg, {Thore Stig} and Stig Munk-Nielsen and Hongbo Zhao",

year = "2023",

month = sep,

day = "4",

doi = "10.23919/EPE23ECCEEurope58414.2023.10264666",

language = "English",

isbn = "979-8-3503-1678-0",

booktitle = "2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe",

publisher = "IEEE (Institute of Electrical and Electronics Engineers)",

address = "United States",

note = "2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) ; Conference date: 04-09-2023 Through 08-09-2023",

}

Jørgensen, AB , Beczkowski, S , Kjærsgaard, BF , Aunsborg, TS , Munk-Nielsen, S & Zhao, H 2023, Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling. in 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe., 10264666, IEEE (Institute of Electrical and Electronics Engineers), 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe), Aalborg, Denmark, 04/09/2023. https://doi.org/10.23919/EPE23ECCEEurope58414.2023.10264666

Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling. / Jørgensen, Asger Bjørn ; Beczkowski, Szymon ; Kjærsgaard, Benjamin Futtrup et al.
2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. IEEE (Institute of Electrical and Electronics Engineers), 2023. 10264666.

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling

AU - Jørgensen, Asger Bjørn

AU - Beczkowski, Szymon

AU - Kjærsgaard, Benjamin Futtrup

AU - Aunsborg, Thore Stig

AU - Munk-Nielsen, Stig

AU - Zhao, Hongbo

PY - 2023/9/4

Y1 - 2023/9/4

N2 - A 3D printed ceramic baseplate-less power module structure with integrated micro-channels for liquid cooling is presented. The main benefit is that parasitic capacitive couplings are removed in comparison with conventional power module packaging. Switching waveforms at 60 kV/us exhibit limited overshoot while good thermal performance is maintained.

AB - A 3D printed ceramic baseplate-less power module structure with integrated micro-channels for liquid cooling is presented. The main benefit is that parasitic capacitive couplings are removed in comparison with conventional power module packaging. Switching waveforms at 60 kV/us exhibit limited overshoot while good thermal performance is maintained.

KW - Additive manufacturing

KW - Packaging

KW - Parasitic elements

KW - SiC MOSFET

KW - Thermal management

UR - http://www.scopus.com/inward/record.url?scp=85175143741&partnerID=8YFLogxK

U2 - 10.23919/EPE23ECCEEurope58414.2023.10264666

DO - 10.23919/EPE23ECCEEurope58414.2023.10264666

M3 - Article in proceeding

SN - 979-8-3503-1678-0

BT - 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe

PB - IEEE (Institute of Electrical and Electronics Engineers)

T2 - 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)

Y2 - 4 September 2023 through 8 September 2023

ER -

Jørgensen AB , Beczkowski S , Kjærsgaard BF , Aunsborg TS , Munk-Nielsen S , Zhao H. Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling. In 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. IEEE (Institute of Electrical and Electronics Engineers). 2023. 10264666 doi: 10.23919/EPE23ECCEEurope58414.2023.10264666

Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling

Abstract

Conference

Keywords

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CoDE: Center of Digitalized Electronics (CoDE)

Cite this

Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling

Abstract

Conference

Keywords

Access to Document

AUB Link

Other files and links

Fingerprint

Projects

CoDE: Center of Digitalized Electronics (CoDE)

Cite this