Comparison of Junction Temperature Measurement Using the TSEP Method and Optical Fiber Method in IGBT Power Modules without Silicone Gel Removal

Kaichen Zhang*, Charles Leduc, Francesco Iannuzzo

*Corresponding author for this work

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

1 Citation (Scopus)
148 Downloads (Pure)

Abstract

The junction temperature is a critical parameter for determining the power cycling capability of power semiconductor devices. Typically, the temperature of the chip is measured indirectly using the temperature-sensitive electrical parameter (TSEP) method or directly using classical infrared (IR) method. However, the TSEP method's suitability for measuring chip temperature in online conditions, especially for complex circuits, has not been adequately demonstrated. The direct measurement method requires removing the silicone gel, making it unsuitable for long-term operation under actual operating conditions. As an alternative approach, optical fibers have been proposed to measure the chip temperature directly through the silicone gel. This paper evaluates both the TSEP method, which measures the saturation voltage under low current, and the optical fiber method for measuring the IGBT's chip temperature under both with and without silicone gel conditions. The initial findings suggest that the presence of silicone gel affects the fiber's response and the chip's temperature distribution. However, the TSEP and optical fiber methods' results are consistent when the silicone gel is removed. The results of this study can contribute to a better understanding of the virtual junction temperature as measured by the TSEP method. Additionally, the findings highlight the advantages and disadvantages of using both the TSEP and optical fiber methods for chip temperature measurement.
Original languageEnglish
Title of host publicationPCIM Europe 2023 : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Number of pages8
PublisherVDE Verlag GMBH
Publication date2023
DOIs
Publication statusPublished - 2023
EventInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2023 - Nuremberg, Germany
Duration: 9 May 202311 May 2023

Conference

ConferenceInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2023
Country/TerritoryGermany
CityNuremberg
Period09/05/202311/05/2023

Fingerprint

Dive into the research topics of 'Comparison of Junction Temperature Measurement Using the TSEP Method and Optical Fiber Method in IGBT Power Modules without Silicone Gel Removal'. Together they form a unique fingerprint.

Cite this