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Abstract
This paper uses the finite element method to analyze the thermal performance of SiC MOSFETs discrete package with different package technologies during short circuit conditions. Firstly, the industrial packaging methods used for power semiconductor devices including SiC MOSFET and Si IGBT are analyzed, which are divided into wire-bonded and press-pack package technologies. Then, the finite element models of wire-bonded and press-pack SiC MOSFET discrete packages are built to analyze the thermal performance with short-circuit conditions. The simulation results show that the press-pack technique performs better with respect to peak temperature under the same electrical conditions.
Original language | English |
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Title of host publication | 2020 22nd European Conference on Power Electronics and Applications, EPE 2020 ECCE Europe |
Publisher | IEEE |
Publication date | Sept 2020 |
Article number | 9215875 |
ISBN (Electronic) | 9789075815368 |
DOIs | |
Publication status | Published - Sept 2020 |
Event | 22nd European Conference on Power Electronics and Applications, EPE 2020 ECCE Europe - Lyon, France Duration: 7 Sept 2020 → 11 Sept 2020 |
Conference
Conference | 22nd European Conference on Power Electronics and Applications, EPE 2020 ECCE Europe |
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Country/Territory | France |
City | Lyon |
Period | 07/09/2020 → 11/09/2020 |
Bibliographical note
Funding Information:This work has been carried out under the APETT Project, funded by the Danish Innovation Foundation, 2017-2021, and under the National Key Research and Development Program of China under Grant 2018YFB0905704.
Publisher Copyright:
© 2020 EPE Association.
Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
Keywords
- finite element modeling
- MOSFET
- press pack
- short circuit
- silicon carbide
Fingerprint
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- 1 Finished
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APETT: Advanced Power Electronic Technology and Tools
Blaabjerg, F., Munk-Nielsen, S., Iannuzzo, F., Wang, H., Uhrenfeldt, C., Beczkowski, S. M., Zhou, D., Choi, U., Jørgensen, A. B., Vernica, I., Sangwongwanich, A., Christensen, N., Ceccarelli, L., Nielsen, C. K., Bahman, A. S., Pedersen, K., Pedersen, K. B. & Kristensen, P. K.
01/01/2017 → 30/06/2021
Project: Research