Computer-aided engineering simulations

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Original languageEnglish
Title of host publicationWide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
EditorsKatsuaki Suganuma
Number of pages25
PublisherWoodhead Publishing
Publication dateJun 2018
Pages199 - 223
Chapter8
ISBN (Print)978-0-08-102094-4
DOIs
Publication statusPublished - Jun 2018
SeriesElsevier
ISSN0922-3444

Keywords

  • Computer-aided engineering
  • Computer software
  • Power electronics
  • Parasitic inductance
  • Reliability modeling
  • SiC module
  • Thermal modeling

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