Condition Monitoring for Submodule Capacitors in Modular Multilevel Converters

Hanyu Wang, Huai Wang, Zhongxu Wang, Yi Zhang, Xuejun Pei, Yong Kang

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55 Citations (Scopus)
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Abstract

This letter proposes a method for the condition monitoring of submodule (SM) capacitors in modular multilevel converters (MMCs) without additional circuitry or computationally heavy algorithm. The proposed method leverages the discharging curve of SM capacitors in connection with the parallel bleeding resistors. It is independent of the MMC control and modulation schemes. Moreover, it potentially does not require thermal and load-related calibration for capacitor degradation monitoring. The principle, case study, and proof of concept of the proposed method are presented.
Original languageEnglish
Article number8718539
JournalIEEE Transactions on Power Electronics
Volume34
Issue number11
Pages (from-to)10403 - 10407
Number of pages5
ISSN0885-8993
DOIs
Publication statusPublished - Nov 2019

Keywords

  • Capacitor
  • Condition monitoring
  • Discharging
  • Modular multilevel converter (MMC)
  • Reliability
  • discharging
  • modular multilevel converter (MMC)
  • reliability
  • condition monitoring

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