Degradation Assessment in IGBT Modules Using Four-Point Probing Approach

    Research output: Contribution to journalJournal articleResearchpeer-review

    23 Citations (Scopus)
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    Abstract

    Four-point probing of electrical parameters on various components of IGBT modules is suggested as an approach for the estimation of degradation in stressed devices. By comparison of these parameters for stressed and new components one can evaluate an overall degradation of the module and find out the wear state of individual components. This knowledge can be applied for preventing early failures and for optimization of the device design. The method is presented by regarding a standard type power module subjected to power cycling.
    Original languageEnglish
    JournalI E E E Transactions on Power Electronics
    Volume30
    Issue number5
    Pages (from-to)2405-2412
    Number of pages8
    ISSN0885-8993
    DOIs
    Publication statusPublished - May 2015

    Fingerprint

    Insulated gate bipolar transistors (IGBT)
    Degradation
    Wear of materials

    Keywords

    • Four-point probing
    • interconnections
    • physics of failure
    • power modules
    • thermo-mechanical degradation

    Cite this

    @article{2e0f7083b9564bf6a25bd891fe8cbb20,
    title = "Degradation Assessment in IGBT Modules Using Four-Point Probing Approach",
    abstract = "Four-point probing of electrical parameters on various components of IGBT modules is suggested as an approach for the estimation of degradation in stressed devices. By comparison of these parameters for stressed and new components one can evaluate an overall degradation of the module and find out the wear state of individual components. This knowledge can be applied for preventing early failures and for optimization of the device design. The method is presented by regarding a standard type power module subjected to power cycling.",
    keywords = "Four-point probing, interconnections, physics of failure, power modules, thermo-mechanical degradation",
    author = "Pedersen, {Kristian Bonderup} and Kristensen, {Peter Kj{\ae}r} and Vladimir Popok and Kjeld Pedersen",
    year = "2015",
    month = "5",
    doi = "10.1109/TPEL.2014.2344174",
    language = "English",
    volume = "30",
    pages = "2405--2412",
    journal = "I E E E Transactions on Power Electronics",
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    publisher = "IEEE",
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    Degradation Assessment in IGBT Modules Using Four-Point Probing Approach. / Pedersen, Kristian Bonderup; Kristensen, Peter Kjær; Popok, Vladimir; Pedersen, Kjeld.

    In: I E E E Transactions on Power Electronics, Vol. 30, No. 5, 05.2015, p. 2405-2412.

    Research output: Contribution to journalJournal articleResearchpeer-review

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    T1 - Degradation Assessment in IGBT Modules Using Four-Point Probing Approach

    AU - Pedersen, Kristian Bonderup

    AU - Kristensen, Peter Kjær

    AU - Popok, Vladimir

    AU - Pedersen, Kjeld

    PY - 2015/5

    Y1 - 2015/5

    N2 - Four-point probing of electrical parameters on various components of IGBT modules is suggested as an approach for the estimation of degradation in stressed devices. By comparison of these parameters for stressed and new components one can evaluate an overall degradation of the module and find out the wear state of individual components. This knowledge can be applied for preventing early failures and for optimization of the device design. The method is presented by regarding a standard type power module subjected to power cycling.

    AB - Four-point probing of electrical parameters on various components of IGBT modules is suggested as an approach for the estimation of degradation in stressed devices. By comparison of these parameters for stressed and new components one can evaluate an overall degradation of the module and find out the wear state of individual components. This knowledge can be applied for preventing early failures and for optimization of the device design. The method is presented by regarding a standard type power module subjected to power cycling.

    KW - Four-point probing

    KW - interconnections

    KW - physics of failure

    KW - power modules

    KW - thermo-mechanical degradation

    U2 - 10.1109/TPEL.2014.2344174

    DO - 10.1109/TPEL.2014.2344174

    M3 - Journal article

    VL - 30

    SP - 2405

    EP - 2412

    JO - I E E E Transactions on Power Electronics

    JF - I E E E Transactions on Power Electronics

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    ER -