Projects per year
Abstract
Original language | English |
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Title of host publication | 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) |
Number of pages | 6 |
Place of Publication | Grenoble, France |
Publisher | IEEE |
Publication date | 24 Aug 2022 |
Article number | 3 |
ISBN (Electronic) | 9781728199337 |
DOIs | |
Publication status | Published - 24 Aug 2022 |
Event | 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Grenoble, France, Grenoble, France Duration: 24 Aug 2022 → 26 Aug 2022 |
Conference
Conference | 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) |
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Location | Grenoble, France |
Country/Territory | France |
City | Grenoble |
Period | 24/08/2022 → 26/08/2022 |
Keywords
- 10 kV SiC MOSFETs
- 3D Thermal Simulation
- Digital design
- Power cycle
- Power module
Fingerprint
Dive into the research topics of 'Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities'. Together they form a unique fingerprint.Projects
- 3 Active
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Developing the Novel Reliability Design Method with 3D-simulation of SiC Power Module
Takahashi, M., Uhrenfeldt, C., Munk-Nielsen, S. & Jørgensen, A. B.
01/10/2021 → 30/09/2024
Project: PhD Project
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CoDE: Center of Digitalized Electronics (CoDE)
Munk-Nielsen, S., Jørgensen, A. B., Uhrenfeldt, C., Beczkowski, S. M., Ahmad, F., Meinert, J. D., Kubulus, P. P., Takahashi, M., Sun, Z., Wang, R., Gao, Y., Zäch, M. R., Meyer, S. & Steffensen, B.
01/01/2021 → 31/12/2025
Project: Research
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MVolt: Medium Voltage Power Electronics for Wind Systems
Munk-Nielsen, S., Uhrenfeldt, C., Jørgensen, A. B., Jørgensen, J. K., Beczkowski, S. M., Bech, M. M., Spender-Andersen, G., Lascu, C., Zhao, H., Dalal, D. N., Kjærsgaard, B. F., Aunsborg, T. S., Jacobsen, J., Mishra, P. & Steffensen, B.
01/10/2020 → 30/09/2024
Project: Research