Effect of Thermal Cycling on Zinc Antimonide Thin Film Thermoelectric Characteristics

Seyed Mojtaba Mir Hosseini; Alireza Rezaniakolaei; Lasse Aistrup Rosendahl; Bo Brommerstedt Iversen

doi:10.1016/j.egypro.2017.12.081

Effect of Thermal Cycling on Zinc Antimonide Thin Film Thermoelectric Characteristics

Seyed Mojtaba Mir Hosseini, Alireza Rezaniakolaei, Lasse Aistrup Rosendahl, Bo Brommerstedt Iversen

Research output: Contribution to journal › Conference article in Journal › Research › peer-review

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Abstract

In this study, performance and stability of zinc antimonide thin film thermoelectric sample is analyzed under transient thermal conditions. The thermoelectric materials are deposited on glass based substrate where the heat flow is parallel with the thermoelectric element length. The specimen is fixed between a heater block and heat sink cooled by the ambient. The thermoelectric element is studied under open circuit and also optimal constant loads corresponding to maximum power output. The thermal cycles are provided for five different hot junction temperatures, 160, 200, 250, 300 and 350 ᵒC. The results show that the thin film has high reliability after thermal and electrical cycles, and no performance degradation is observed.

Original language	English
Journal	Energy Procedia
Volume	142
Pages (from-to)	519-524
Number of pages	5
ISSN	1876-6102
DOIs	https://doi.org/10.1016/j.egypro.2017.12.081
Publication status	Published - Dec 2017
Event	9th International Conference on Applied Energy, ICAE2017, 21-24 August 2017, Cardiff, UK - Duration: 21 Aug 2017 → 24 Aug 2017

Conference

Conference	9th International Conference on Applied Energy, ICAE2017, 21-24 August 2017, Cardiff, UK
Period	21/08/2017 → 24/08/2017

Keywords

Thin Film TEG
Thermal Cycling
Zinc Antimonide
Transient Behavior
Energy Generation

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10.1016/j.egypro.2017.12.081Licence: CC BY-NC-ND 4.0

Open Access articleFinal published version, 785 KBLicence: CC BY-NC-ND 4.0

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@inproceedings{e88b63aa7984429096311938431c5f85,

title = "Effect of Thermal Cycling on Zinc Antimonide Thin Film Thermoelectric Characteristics",

abstract = "In this study, performance and stability of zinc antimonide thin film thermoelectric sample is analyzed under transient thermal conditions. The thermoelectric materials are deposited on glass based substrate where the heat flow is parallel with the thermoelectric element length. The specimen is fixed between a heater block and heat sink cooled by the ambient. The thermoelectric element is studied under open circuit and also optimal constant loads corresponding to maximum power output. The thermal cycles are provided for five different hot junction temperatures, 160, 200, 250, 300 and 350 ᵒC. The results show that the thin film has high reliability after thermal and electrical cycles, and no performance degradation is observed.",

keywords = "Thin Film TEG, Thermal Cycling, Zinc Antimonide, Transient Behavior, Energy Generation",

author = "Hosseini, {Seyed Mojtaba Mir} and Alireza Rezaniakolaei and Rosendahl, {Lasse Aistrup} and Iversen, {Bo Brommerstedt}",

year = "2017",

month = dec,

doi = "10.1016/j.egypro.2017.12.081",

language = "English",

volume = "142",

pages = "519--524",

journal = "Energy Procedia",

issn = "1876-6102",

publisher = "Elsevier",

note = "9th International Conference on Applied Energy, ICAE2017, 21-24 August 2017, Cardiff, UK ; Conference date: 21-08-2017 Through 24-08-2017",

}

TY - GEN

T1 - Effect of Thermal Cycling on Zinc Antimonide Thin Film Thermoelectric Characteristics

AU - Hosseini, Seyed Mojtaba Mir

AU - Rezaniakolaei, Alireza

AU - Rosendahl, Lasse Aistrup

AU - Iversen, Bo Brommerstedt

PY - 2017/12

Y1 - 2017/12

N2 - In this study, performance and stability of zinc antimonide thin film thermoelectric sample is analyzed under transient thermal conditions. The thermoelectric materials are deposited on glass based substrate where the heat flow is parallel with the thermoelectric element length. The specimen is fixed between a heater block and heat sink cooled by the ambient. The thermoelectric element is studied under open circuit and also optimal constant loads corresponding to maximum power output. The thermal cycles are provided for five different hot junction temperatures, 160, 200, 250, 300 and 350 ᵒC. The results show that the thin film has high reliability after thermal and electrical cycles, and no performance degradation is observed.

AB - In this study, performance and stability of zinc antimonide thin film thermoelectric sample is analyzed under transient thermal conditions. The thermoelectric materials are deposited on glass based substrate where the heat flow is parallel with the thermoelectric element length. The specimen is fixed between a heater block and heat sink cooled by the ambient. The thermoelectric element is studied under open circuit and also optimal constant loads corresponding to maximum power output. The thermal cycles are provided for five different hot junction temperatures, 160, 200, 250, 300 and 350 ᵒC. The results show that the thin film has high reliability after thermal and electrical cycles, and no performance degradation is observed.

KW - Thin Film TEG

KW - Thermal Cycling

KW - Zinc Antimonide

KW - Transient Behavior

KW - Energy Generation

U2 - 10.1016/j.egypro.2017.12.081

DO - 10.1016/j.egypro.2017.12.081

M3 - Conference article in Journal

SN - 1876-6102

VL - 142

SP - 519

EP - 524

JO - Energy Procedia

JF - Energy Procedia

T2 - 9th International Conference on Applied Energy, ICAE2017, 21-24 August 2017, Cardiff, UK

Y2 - 21 August 2017 through 24 August 2017

ER -

Effect of Thermal Cycling on Zinc Antimonide Thin Film Thermoelectric Characteristics

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