Effects of Removing Bottom-side Copper in Baseplate-less Power Modules

Nikolaj Helmer Kristensen; Jakob Iversen Deichgraeber; Kerim Brackovic; Szymon Michal Beczkowski; Stig Munk-Nielsen; Asger Bjørn Jørgensen

doi:10.34746/epe2025-0190

Effects of Removing Bottom-side Copper in Baseplate-less Power Modules

Nikolaj Helmer Kristensen^*, Jakob Iversen Deichgraeber, Kerim Brackovic, Szymon Michal Beczkowski, Stig Munk-Nielsen, Asger Bjørn Jørgensen

^*Corresponding author for this work

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

Abstract

Performance of SiC MOSFETs are limited by the inherent parasitic elements originating from the packaging structure. In this paper, the parasitic capacitance of a 1.2 kV SiC MOSFET half-bridge power module is significantly reduced by removing the bottom-side copper, and the influence on its electrical and thermal performance is experimentally evaluated. Finally it is concluded that even though the modified module show significant advantages in turn-on switching energy, an increase in turn-off energy offsets it while also achieving a worse thermal performance.

Original language	English
Title of host publication	2025 26th European Conference on Power Electronics and Applications (EPE'25 ECCE Europe)
Number of pages	8
Publication date	31 Mar 2025
DOIs	https://doi.org/10.34746/epe2025-0190
Publication status	Published - 31 Mar 2025
Event	2025 26th European Conference on Power Electronics and Applications (EPE'25 ECCE Europe) - Paris, France Duration: 31 Mar 2025 → 4 Apr 2025 Conference number: 26 https://epe2025.com

Conference

Conference	2025 26th European Conference on Power Electronics and Applications (EPE'25 ECCE Europe)
Number	26
Country/Territory	France
City	Paris
Period	31/03/2025 → 04/04/2025
Internet address	https://epe2025.com

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10.34746/epe2025-0190

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CoDE: Center of Digitalized Electronics (CoDE)
Munk-Nielsen, S. (PI), Jørgensen, A. B. (CoPI), Uhrenfeldt, C. (CoPI), Beczkowski, S. M. (Project Participant), Ahmad, F. (Project Participant), Meinert, J. D. (Project Participant), Kubulus, P. P. (Project Participant), Takahashi, M. (Project Participant), Sun, Z. (Project Participant), Wang, R. (Project Participant), Gao, Y. (Project Participant), Zäch, M. R. (Project Participant), Meyer, S. (Project Participant), Liccardi, S. (Project Participant), Kristensen, N. H. (Project Participant) & Steffensen, B. (Project Coordinator)
Poul Due Jensen Foundation
01/01/2021 → 31/12/2026
Project: Research

Cite this

@inproceedings{79e7e36634db46c3845f00b8a8f7c543,

title = "Effects of Removing Bottom-side Copper in Baseplate-less Power Modules",

abstract = "Performance of SiC MOSFETs are limited by the inherent parasitic elements originating from the packaging structure. In this paper, the parasitic capacitance of a 1.2 kV SiC MOSFET half-bridge power module is significantly reduced by removing the bottom-side copper, and the influence on its electrical and thermal performance is experimentally evaluated. Finally it is concluded that even though the modified module show significant advantages in turn-on switching energy, an increase in turn-off energy offsets it while also achieving a worse thermal performance. ",

author = "Kristensen, {Nikolaj Helmer} and Deichgraeber, {Jakob Iversen} and Kerim Brackovic and Beczkowski, {Szymon Michal} and Stig Munk-Nielsen and J{\o}rgensen, {Asger Bj{\o}rn}",

year = "2025",

month = mar,

day = "31",

doi = "10.34746/epe2025-0190",

language = "English",

booktitle = "2025 26th European Conference on Power Electronics and Applications (EPE'25 ECCE Europe)",

note = "2025 26th European Conference on Power Electronics and Applications (EPE'25 ECCE Europe), EPE 2025 ; Conference date: 31-03-2025 Through 04-04-2025",

url = "https://epe2025.com",

}

Kristensen, NH, Deichgraeber, JI, Brackovic, K, Beczkowski, SM , Munk-Nielsen, S & Jørgensen, AB 2025, Effects of Removing Bottom-side Copper in Baseplate-less Power Modules. in 2025 26th European Conference on Power Electronics and Applications (EPE'25 ECCE Europe). 2025 26th European Conference on Power Electronics and Applications (EPE'25 ECCE Europe), Paris, France, 31/03/2025. https://doi.org/10.34746/epe2025-0190

Effects of Removing Bottom-side Copper in Baseplate-less Power Modules. / Kristensen, Nikolaj Helmer; Deichgraeber, Jakob Iversen; Brackovic, Kerim et al.
2025 26th European Conference on Power Electronics and Applications (EPE'25 ECCE Europe). 2025.

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Effects of Removing Bottom-side Copper in Baseplate-less Power Modules

AU - Kristensen, Nikolaj Helmer

AU - Deichgraeber, Jakob Iversen

AU - Brackovic, Kerim

AU - Beczkowski, Szymon Michal

AU - Munk-Nielsen, Stig

AU - Jørgensen, Asger Bjørn

N1 - Conference code: 26

PY - 2025/3/31

Y1 - 2025/3/31

N2 - Performance of SiC MOSFETs are limited by the inherent parasitic elements originating from the packaging structure. In this paper, the parasitic capacitance of a 1.2 kV SiC MOSFET half-bridge power module is significantly reduced by removing the bottom-side copper, and the influence on its electrical and thermal performance is experimentally evaluated. Finally it is concluded that even though the modified module show significant advantages in turn-on switching energy, an increase in turn-off energy offsets it while also achieving a worse thermal performance.

AB - Performance of SiC MOSFETs are limited by the inherent parasitic elements originating from the packaging structure. In this paper, the parasitic capacitance of a 1.2 kV SiC MOSFET half-bridge power module is significantly reduced by removing the bottom-side copper, and the influence on its electrical and thermal performance is experimentally evaluated. Finally it is concluded that even though the modified module show significant advantages in turn-on switching energy, an increase in turn-off energy offsets it while also achieving a worse thermal performance.

U2 - 10.34746/epe2025-0190

DO - 10.34746/epe2025-0190

M3 - Article in proceeding

BT - 2025 26th European Conference on Power Electronics and Applications (EPE'25 ECCE Europe)

T2 - 2025 26th European Conference on Power Electronics and Applications (EPE'25 ECCE Europe)

Y2 - 31 March 2025 through 4 April 2025

ER -

Effects of Removing Bottom-side Copper in Baseplate-less Power Modules

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CoDE: Center of Digitalized Electronics (CoDE)

Cite this