Effects of the HV-BIGT Design Elements on the High-Frequency Oscillation Instability during Short Circuit Transients

P. Diaz Reigosa, C. Papadopoulos, F. Iannuzzo, C. Corvasce, M. Rahimo

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

2 Citations (Scopus)

Abstract

The design elements of the Bi-mode Insulated Gate Transistor BIGT show that the combination of the high hole injection levels supplied from the collector together with the presence of a localized lifetime control at the MOS cells have brought improvements on the short circuit capability, strongly minimizing the high-frequency oscillations observed in IGBTs. The BIGT concept and the traditional IGBT structures have been compared under short circuit conditions to investigate the charge-field interactions at the MOS cells, triggering the oscillation mechanism. The effect of the lifetime control and the irradiation method on the short circuit capability is investigated.
Original languageEnglish
Title of host publicationProceedings of 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)
Number of pages4
PublisherIEEE
Publication dateMay 2019
Pages55-58
Article number8757575
ISBN (Print)978-1-7281-0580-2
ISBN (Electronic)978-1-7281-0581-9
DOIs
Publication statusPublished - May 2019
Event31st International Symposium on Power Semiconductor Devices and ICs, ISPSD 2019 - Shanghai, China
Duration: 19 May 201923 May 2019

Conference

Conference31st International Symposium on Power Semiconductor Devices and ICs, ISPSD 2019
Country/TerritoryChina
CityShanghai
Period19/05/201923/05/2019
SeriesProceedings of the International Symposium on Power Semiconductor Devices and ICs
Volume2019-May
ISSN1063-6854

Keywords

  • BIGT
  • Bipolar gain
  • Gate oscillations
  • IGBT
  • Kirk Effect
  • Parametric oscillation
  • Robustness
  • Short circuit
  • TCAD

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