Effects of thermal cycling on aluminum metallization of power diodes

Mads Brincker; Kristian Bonderup Pedersen; Peter Kjær Kristensen; Vladimir Popok

doi:10.1016/j.microrel.2015.06.005

Effects of thermal cycling on aluminum metallization of power diodes

Mads Brincker, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir Popok

Research output: Contribution to journal › Conference article in Journal › Research › peer-review

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Abstract

Reconstruction of aluminum metallization on top of power electronic chips is a well-known wear out phenomenon under power cycling conditions. However, the origins of reconstruction are still under discussion. In the current study, a method for carrying out passive thermal cycling of power diodes in a controlled environment is developed, thus eliminating possible contribution to degradation from electric current and humidity. The focus is centered on the structural changes in the top Al metallization layer of the power diodes, correlated with the
change of sheet resistance. Since the atmosphere is controlled and the device is not subjected to a current load the observed degradation of metallization and corresponding increase of resistance is purely induced by thermo-mechanical stress. A correlation between number of cycles, micro-structural evolution, and sheet resistance is found and conclusions on the dominant role of thermo-mechanical stresses are achieved. Additionally, proposals are made on how the current thermal test setup can be further developed to study the role of corrosion.

Original language	English
Journal	Microelectronics Reliability
Volume	55
Pages (from-to)	1988-1991
Number of pages	4
ISSN	0026-2714
DOIs	https://doi.org/10.1016/j.microrel.2015.06.005
Publication status	Published - 16 Oct 2015
Event	26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Toulouse, France Duration: 5 Oct 2015 → 9 Oct 2015

Conference

Conference	26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Country/Territory	France
City	Toulouse
Period	05/10/2015 → 09/10/2015

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10.1016/j.microrel.2015.06.005

http://www.sciencedirect.com/science/article/pii/S0026271415001353

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title = "Effects of thermal cycling on aluminum metallization of power diodes",

abstract = "Reconstruction of aluminum metallization on top of power electronic chips is a well-known wear out phenomenon under power cycling conditions. However, the origins of reconstruction are still under discussion. In the current study, a method for carrying out passive thermal cycling of power diodes in a controlled environment is developed, thus eliminating possible contribution to degradation from electric current and humidity. The focus is centered on the structural changes in the top Al metallization layer of the power diodes, correlated with thechange of sheet resistance. Since the atmosphere is controlled and the device is not subjected to a current load the observed degradation of metallization and corresponding increase of resistance is purely induced by thermo-mechanical stress. A correlation between number of cycles, micro-structural evolution, and sheet resistance is found and conclusions on the dominant role of thermo-mechanical stresses are achieved. Additionally, proposals are made on how the current thermal test setup can be further developed to study the role of corrosion.",

author = "Mads Brincker and Pedersen, {Kristian Bonderup} and Kristensen, {Peter Kj{\ae}r} and Vladimir Popok",

year = "2015",

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doi = "10.1016/j.microrel.2015.06.005",

language = "English",

volume = "55",

pages = "1988--1991",

journal = "Microelectronics Reliability",

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note = "26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis ; Conference date: 05-10-2015 Through 09-10-2015",

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T1 - Effects of thermal cycling on aluminum metallization of power diodes

AU - Brincker, Mads

AU - Pedersen, Kristian Bonderup

AU - Kristensen, Peter Kjær

AU - Popok, Vladimir

PY - 2015/10/16

Y1 - 2015/10/16

N2 - Reconstruction of aluminum metallization on top of power electronic chips is a well-known wear out phenomenon under power cycling conditions. However, the origins of reconstruction are still under discussion. In the current study, a method for carrying out passive thermal cycling of power diodes in a controlled environment is developed, thus eliminating possible contribution to degradation from electric current and humidity. The focus is centered on the structural changes in the top Al metallization layer of the power diodes, correlated with thechange of sheet resistance. Since the atmosphere is controlled and the device is not subjected to a current load the observed degradation of metallization and corresponding increase of resistance is purely induced by thermo-mechanical stress. A correlation between number of cycles, micro-structural evolution, and sheet resistance is found and conclusions on the dominant role of thermo-mechanical stresses are achieved. Additionally, proposals are made on how the current thermal test setup can be further developed to study the role of corrosion.

AB - Reconstruction of aluminum metallization on top of power electronic chips is a well-known wear out phenomenon under power cycling conditions. However, the origins of reconstruction are still under discussion. In the current study, a method for carrying out passive thermal cycling of power diodes in a controlled environment is developed, thus eliminating possible contribution to degradation from electric current and humidity. The focus is centered on the structural changes in the top Al metallization layer of the power diodes, correlated with thechange of sheet resistance. Since the atmosphere is controlled and the device is not subjected to a current load the observed degradation of metallization and corresponding increase of resistance is purely induced by thermo-mechanical stress. A correlation between number of cycles, micro-structural evolution, and sheet resistance is found and conclusions on the dominant role of thermo-mechanical stresses are achieved. Additionally, proposals are made on how the current thermal test setup can be further developed to study the role of corrosion.

U2 - 10.1016/j.microrel.2015.06.005

DO - 10.1016/j.microrel.2015.06.005

M3 - Conference article in Journal

SN - 0026-2714

VL - 55

SP - 1988

EP - 1991

JO - Microelectronics Reliability

JF - Microelectronics Reliability

T2 - 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis

Y2 - 5 October 2015 through 9 October 2015

ER -

Effects of thermal cycling on aluminum metallization of power diodes

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