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This paper presents an electrical impedance characterization and measurement method for monitoring bone fracture healing progress after osteosynthesis, for cases applying an intramedullary nail. While existing solutions fail due to the presence of the nail, the proposed method makes active use of the nail to achieve accurate healing progress monitoring. The proposed method captures variations in the electrical impedance at the fracture site as body tissues transform from blood (hematoma) to fully recovered intact bone during healing. The proposed method therefore has the potential to be used for data acquisition of bone healing and pave the way for digitized diagnosis and treatment of bone fractures.
Original languageEnglish
Title of host publicationThe 20th IEEE International Conference on BioInformatics And BioEngineering
Number of pages4
Publication date2020
ISBN (Print)978-1-7281-9575-9
ISBN (Electronic)978-1-7281-9574-2
Publication statusPublished - 2020
Event2020 IEEE 20th International Conference on Bioinformatics and Bioengineering (BIBE) - Cincinnati, United States
Duration: 26 Oct 202028 Oct 2020


Conference2020 IEEE 20th International Conference on Bioinformatics and Bioengineering (BIBE)
Country/TerritoryUnited States
SeriesInternational Conference on Bioinformatics and Bioengineering


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