Electro-Thermal Digital Twin for GaN eHEMT Power Modules Temperature Characterization during Power Cycling Tests

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Abstract

The thermal behavior of power modules significantly impacts their power cycling lifetime by influencing power loss generation in the electrical domain and subsequently altering the temperature response. This study introduces a coupled electro-thermal digital twin designed to accurately predict the junction temperature during power cycling tests of wide band gap power modules and to provide detailed insights into the package’s internal temperature distribution. The implementation, achieved through the integration of LTspice and COMSOL simulations governed by MATLAB scripts, is detailed. Numerical and experimental analyses focusing on GaN eHEMT power modules confirm the enhanced precision of this integrated approach. It achieves a 0.8% prediction discrepancy on the maximum junction temperature of 91 °C and offers a maximum 12% reduction in error throughout the heating periods when compared to standalone thermal simulations.
Original languageEnglish
Title of host publication2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
Number of pages6
PublisherIEEE (Institute of Electrical and Electronics Engineers)
Publication date17 May 2024
Pages4032-4037
ISBN (Electronic)9798350351330
DOIs
Publication statusPublished - 17 May 2024
Event 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) - Chengdu, China
Duration: 17 May 202420 May 2024
https://ieeexplore.ieee.org/xpl/conhome/10567049/proceeding

Conference

Conference 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
Country/TerritoryChina
CityChengdu
Period17/05/202420/05/2024
Internet address

Keywords

  • Digital twin
  • Electro-thermal
  • Power cycling
  • Temperature characterization

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