Failure analysis of high-voltage power MOSFET in the three phase inverter

Peng Xue, Guicui Fu

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

1 Citation (Scopus)

Abstract

This paper presents a failure analysis procedure on a power MOSFET in a three phase inverter. The analyzed power MOSFET has been obtained from a chopper leg in a three phase inverter when an anomalous failure is detected. At first, the X-ray microscope is utilized to inspect the failed device. A hint of the burn-out area in the chip is observed in the cross-section X-ray microscopy image. After that, the device is decapped and the internal chip is inspected. Two burn-out cavities, together with some cracks and melted areas are observed on the silicon chip. The signature of the burn-out cavities suggests that the device failure is induced by the current filamentation induced by high operation temperature. Thanks to the Scanning Acoustic Microscope (SAM) analysis, large void spot was found in the solider layer. This indicate that the device's high operation temperature is due to the degradation of the solider layer.

Original languageEnglish
Title of host publicationProceedings of 2016 Prognostics and System Health Management Conference, PHM-Chengdu 2016
EditorsQiang Miao, Zhaojun Li, Ming J. Zuo, Liudong Xing, Zhigang Tian
PublisherIEEE Signal Processing Society
Publication date16 Jan 2017
Article number7819822
ISBN (Electronic)9781509027781
DOIs
Publication statusPublished - 16 Jan 2017
Event7th IEEE Prognostics and System Health Management Conference, PHM-Chengdu 2016 - Chengdu, Sichuan, China
Duration: 19 Oct 201621 Oct 2016

Conference

Conference7th IEEE Prognostics and System Health Management Conference, PHM-Chengdu 2016
Country/TerritoryChina
CityChengdu, Sichuan
Period19/10/201621/10/2016
SeriesProceedings of 2016 Prognostics and System Health Management Conference, PHM-Chengdu 2016

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

Keywords

  • Component
  • Failure analysis
  • Power MOSFET
  • SAM analysis
  • Voids

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