Failure Analysis on Direct Bonded Copper Substrates after Thermal Cycle in Different Mounting Conditions PC 15.5

Johannes Juul Mikkelsen

Failure Analysis on Direct Bonded Copper Substrates after Thermal Cycle in Different Mounting Conditions PC 15.5

Johannes Juul Mikkelsen

AAU Energy

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research

Original language	English
Title of host publication	PCIM'2001 : Proceedings of the International Intelligent Motion (Motor-Con) Conference, Nürnberg, Germany, June, 2001
Publisher	PCIM
Publication date	2001
Pages	467-472
ISBN (Print)	3928643274
Publication status	Published - 2001
Event	Failure Analysis on Direct Bonded Copper Substrates after Thermal Cycle in Different Mounting Conditions PC 15.5 - Duration: 19 May 2010 → …

Conference

Conference	Failure Analysis on Direct Bonded Copper Substrates after Thermal Cycle in Different Mounting Conditions PC 15.5
Period	19/05/2010 → …

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Cite this

@inproceedings{3f484e60809411db8b97000ea68e967b,

title = "Failure Analysis on Direct Bonded Copper Substrates after Thermal Cycle in Different Mounting Conditions PC 15.5",

author = "Mikkelsen, {Johannes Juul}",

year = "2001",

language = "English",

isbn = "3928643274",

pages = "467--472",

booktitle = "PCIM'2001 : Proceedings of the International Intelligent Motion (Motor-Con) Conference, N{\"u}rnberg, Germany, June, 2001",

publisher = "PCIM",

note = "Failure Analysis on Direct Bonded Copper Substrates after Thermal Cycle in Different Mounting Conditions PC 15.5 ; Conference date: 19-05-2010",

}

Mikkelsen, JJ 2001, Failure Analysis on Direct Bonded Copper Substrates after Thermal Cycle in Different Mounting Conditions PC 15.5. in PCIM'2001 : Proceedings of the International Intelligent Motion (Motor-Con) Conference, Nürnberg, Germany, June, 2001. PCIM, pp. 467-472, Failure Analysis on Direct Bonded Copper Substrates after Thermal Cycle in Different Mounting Conditions PC 15.5, 19/05/2010.

Failure Analysis on Direct Bonded Copper Substrates after Thermal Cycle in Different Mounting Conditions PC 15.5. / Mikkelsen, Johannes Juul.
PCIM'2001 : Proceedings of the International Intelligent Motion (Motor-Con) Conference, Nürnberg, Germany, June, 2001. PCIM, 2001. p. 467-472.

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research

TY - GEN

T1 - Failure Analysis on Direct Bonded Copper Substrates after Thermal Cycle in Different Mounting Conditions PC 15.5

AU - Mikkelsen, Johannes Juul

PY - 2001

Y1 - 2001

M3 - Article in proceeding

SN - 3928643274

SP - 467

EP - 472

BT - PCIM'2001 : Proceedings of the International Intelligent Motion (Motor-Con) Conference, Nürnberg, Germany, June, 2001

PB - PCIM

T2 - Failure Analysis on Direct Bonded Copper Substrates after Thermal Cycle in Different Mounting Conditions PC 15.5

Y2 - 19 May 2010

ER -