FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems

Amir Sajjad Bahman; Ke Ma; Frede Blaabjerg

FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems

Amir Sajjad Bahman, Ke Ma, Frede Blaabjerg

AAU Energy

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

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Abstract

Thermal management of high power IGBT (Insulated Gate Bipolar Transistor) modules is crucial to ensure the reliable operation of power electronic systems especially in wind power applications. The important stage in thermal management of power modules is temperature estimation inside the IGBT modules. Generally, thermal information on datasheet is used to estimate transistor and diode chip temperatures, but this information is based on average and rough temperature measurements. In addition this information does not consider thermal coupling impact between the chips and the impact of different cooling conditions on thermal behavior of power module. In this paper, a detailed 3D thermal network of high power module is presented based on FEM (Finite Element Method) simulation. The thermal coupling impact between chips will be studied and the transient thermal impedances will be examined under different cooling conditions. Finally, the extracted thermal network will be validated with a circuit simulator for a fast temperature estimation with a given loss profile.

Original language	English
Title of host publication	Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014
Number of pages	7
Publisher	Chungbuk University, Korea
Publication date	Oct 2014
Pages	1-7
Publication status	Published - Oct 2014
Event	International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014 - Jeju, Korea, Republic of Duration: 20 Oct 2014 → 22 Oct 2014

Conference

Conference	International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014
Country/Territory	Korea, Republic of
City	Jeju
Period	20/10/2014 → 22/10/2014

Keywords

Finite Elemennt Method
High power modules
Transient thermal impedance
Thermal coupling

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FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine SystemsAccepted author manuscript, 1.07 MB

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Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Project: Research

Cite this

@inproceedings{410831ead2cc4cbabbf58d2cc6416e7b,

title = "FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems",

abstract = "Thermal management of high power IGBT (Insulated Gate Bipolar Transistor) modules is crucial to ensure the reliable operation of power electronic systems especially in wind power applications. The important stage in thermal management of power modules is temperature estimation inside the IGBT modules. Generally, thermal information on datasheet is used to estimate transistor and diode chip temperatures, but this information is based on average and rough temperature measurements. In addition this information does not consider thermal coupling impact between the chips and the impact of different cooling conditions on thermal behavior of power module. In this paper, a detailed 3D thermal network of high power module is presented based on FEM (Finite Element Method) simulation. The thermal coupling impact between chips will be studied and the transient thermal impedances will be examined under different cooling conditions. Finally, the extracted thermal network will be validated with a circuit simulator for a fast temperature estimation with a given loss profile. ",

keywords = "Finite Elemennt Method, High power modules, Transient thermal impedance, Thermal coupling",

author = "Bahman, {Amir Sajjad} and Ke Ma and Frede Blaabjerg",

year = "2014",

month = oct,

language = "English",

pages = "1--7",

booktitle = "Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014",

publisher = "Chungbuk University, Korea",

note = "International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014 ; Conference date: 20-10-2014 Through 22-10-2014",

}

Bahman, AS, Ma, K & Blaabjerg, F 2014, FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems. in Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014. Chungbuk University, Korea, pp. 1-7, International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014, Jeju, Korea, Republic of, 20/10/2014.

FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems. / Bahman, Amir Sajjad; Ma, Ke; Blaabjerg, Frede.
Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014. Chungbuk University, Korea, 2014. p. 1-7.

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems

AU - Bahman, Amir Sajjad

AU - Ma, Ke

AU - Blaabjerg, Frede

PY - 2014/10

Y1 - 2014/10

N2 - Thermal management of high power IGBT (Insulated Gate Bipolar Transistor) modules is crucial to ensure the reliable operation of power electronic systems especially in wind power applications. The important stage in thermal management of power modules is temperature estimation inside the IGBT modules. Generally, thermal information on datasheet is used to estimate transistor and diode chip temperatures, but this information is based on average and rough temperature measurements. In addition this information does not consider thermal coupling impact between the chips and the impact of different cooling conditions on thermal behavior of power module. In this paper, a detailed 3D thermal network of high power module is presented based on FEM (Finite Element Method) simulation. The thermal coupling impact between chips will be studied and the transient thermal impedances will be examined under different cooling conditions. Finally, the extracted thermal network will be validated with a circuit simulator for a fast temperature estimation with a given loss profile.

AB - Thermal management of high power IGBT (Insulated Gate Bipolar Transistor) modules is crucial to ensure the reliable operation of power electronic systems especially in wind power applications. The important stage in thermal management of power modules is temperature estimation inside the IGBT modules. Generally, thermal information on datasheet is used to estimate transistor and diode chip temperatures, but this information is based on average and rough temperature measurements. In addition this information does not consider thermal coupling impact between the chips and the impact of different cooling conditions on thermal behavior of power module. In this paper, a detailed 3D thermal network of high power module is presented based on FEM (Finite Element Method) simulation. The thermal coupling impact between chips will be studied and the transient thermal impedances will be examined under different cooling conditions. Finally, the extracted thermal network will be validated with a circuit simulator for a fast temperature estimation with a given loss profile.

KW - Finite Elemennt Method

KW - High power modules

KW - Transient thermal impedance

KW - Thermal coupling

M3 - Article in proceeding

SP - 1

EP - 7

BT - Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014

PB - Chungbuk University, Korea

T2 - International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014

Y2 - 20 October 2014 through 22 October 2014

ER -

FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems

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Conference

Keywords

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Projects

Center Of Reliable Power Electronics (CORPE)

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