Finite Element Modeling of IGBT Modules to Explore the Correlation between Electric Parameters and Damage in Bond Wires

Maogong Jiang , Guicui Fu, Lorenzo Ceccarelli, He Du, Martin Bendix Fogsgaard, Amir Sajjad Bahman, Yongheng Yang, Francesco Iannuzzo

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

Abstract

This paper proposes a method to identify damage-sensitive electrical parameters (DESPs) for insulated gate bipolar transistor (IGBT) bond wires. Multiphysics simulations are performed to emulate the realistic electrical, thermal and mechanical behaviors of IGBT module. Temperature-dependent material properties are considered in silicon chips and aluminum bond wires. Steady-state electro-thermo-mechanical simulation results of IGBT modules in a given collector current are presented. The degradation mechanisms of wire-bonding crack propagation and complete lift-off are explored. Simulations are validated through the power cycling tests. The trend of measured forward voltage V CE(on) is similar to the simulation result. The modeling method and results can be used to evaluate the health status of IGBT module bond wires.
Original languageEnglish
Title of host publicationProceedings of 2019 IEEE Energy Conversion Congress and Exposition (ECCE)
Number of pages6
PublisherIEEE Press
Publication dateSep 2019
Pages839-844
Article number8912236
ISBN (Electronic)9781728103952
DOIs
Publication statusPublished - Sep 2019
Event2019 IEEE Energy Conversion Congress and Exposition (ECCE) - Baltimore, United States
Duration: 29 Sep 20193 Oct 2019

Conference

Conference2019 IEEE Energy Conversion Congress and Exposition (ECCE)
CountryUnited States
City Baltimore
Period29/09/201903/10/2019
SeriesIEEE Energy Conversion Congress and Exposition
ISSN2329-3721

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Keywords

  • IGBT
  • Bond wires
  • Crack
  • Lift-off
  • Electric parameter
  • Finite element model

Cite this

Jiang , M., Fu, G., Ceccarelli, L., Du, H., Fogsgaard, M. B., Bahman, A. S., Yang, Y., & Iannuzzo, F. (2019). Finite Element Modeling of IGBT Modules to Explore the Correlation between Electric Parameters and Damage in Bond Wires. In Proceedings of 2019 IEEE Energy Conversion Congress and Exposition (ECCE) (pp. 839-844). [8912236] IEEE Press. IEEE Energy Conversion Congress and Exposition https://doi.org/10.1109/ECCE.2019.8912236