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Finite Element Modeling of IGBT Modules to Explore the Correlation between Electric Parameters and Damage in Bond Wires
Maogong Jiang , Guicui Fu, Lorenzo Ceccarelli, He Du, Martin Bendix Fogsgaard, Amir Sajjad Bahman, Yongheng Yang, Francesco Iannuzzo
Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
10
Citations
(Scopus)