Fundamental-frequency and load-varying thermal cycles effects on lifetime estimation of DFIG power converter

G. Zhang; D. Zhou; J. Yang; F. Blaabjerg

doi:10.1016/j.microrel.2017.06.069

Fundamental-frequency and load-varying thermal cycles effects on lifetime estimation of DFIG power converter

G. Zhang, D. Zhou, J. Yang, F. Blaabjerg

Research output: Contribution to journal › Conference article in Journal › Research › peer-review

16 Citations (Scopus)

Abstract

In respect to a Doubly-Fed Induction Generator (DFIG) system, its corresponding time scale varies from microsecond level of power semiconductor switching to second level of the mechanical response. In order to map annual thermal profile of the power semiconductors, different approaches have been adopted to handle the fundamental-frequency thermal cycles and load-varying thermal cycles. Their effects on lifetime estimation of the power device in the Back-to-Back (BTB) power converter are evaluated.

Original language	English
Journal	Microelectronics Reliability
Volume	76-77
Pages (from-to)	549-555
Number of pages	7
ISSN	0026-2714
DOIs	https://doi.org/10.1016/j.microrel.2017.06.069
Publication status	Published - Sept 2017
Event	28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) - Bordeaux, France Duration: 25 Sept 2017 → 28 Sept 2017

Conference

Conference	28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)
Country/Territory	France
City	Bordeaux
Period	25/09/2017 → 28/09/2017

Keywords

DFIG wind power system
Lifetime estimation
Thermal cycles

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10.1016/j.microrel.2017.06.069

AUB Link

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APETT: Advanced Power Electronic Technology and Tools
Blaabjerg, F. (PI), Munk-Nielsen, S. (CoI), Iannuzzo, F. (Project Participant), Wang, H. (Project Participant), Uhrenfeldt, C. (Project Participant), Beczkowski, S. (Project Participant), Zhou, D. (Project Participant), Choi, U. (Project Participant), Jørgensen, A. B. (Project Participant), Vernica, I. (Project Participant), Sangwongwanich, A. (Project Participant), Christensen, N. (Project Participant), Ceccarelli, L. (Project Participant), Nielsen, C. K. (Project Participant), Bahman, A. S. (Project Participant), Pedersen, K. (Project Participant), Pedersen, K. B. (Project Participant) & Kristensen, P. K. (Project Participant)
Innovation Fund Denmark
01/01/2017 → 30/06/2021
Project: Research

Cite this

@inproceedings{11c2e8bfb0a04714a7f831d82ab6eb4e,

title = "Fundamental-frequency and load-varying thermal cycles effects on lifetime estimation of DFIG power converter",

abstract = "In respect to a Doubly-Fed Induction Generator (DFIG) system, its corresponding time scale varies from microsecond level of power semiconductor switching to second level of the mechanical response. In order to map annual thermal profile of the power semiconductors, different approaches have been adopted to handle the fundamental-frequency thermal cycles and load-varying thermal cycles. Their effects on lifetime estimation of the power device in the Back-to-Back (BTB) power converter are evaluated. ",

keywords = "DFIG wind power system, Lifetime estimation, Thermal cycles",

author = "G. Zhang and D. Zhou and J. Yang and F. Blaabjerg",

year = "2017",

month = sep,

doi = "10.1016/j.microrel.2017.06.069",

language = "English",

volume = "76-77",

pages = "549--555",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier",

note = "28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) ; Conference date: 25-09-2017 Through 28-09-2017",

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T1 - Fundamental-frequency and load-varying thermal cycles effects on lifetime estimation of DFIG power converter

AU - Zhang, G.

AU - Zhou, D.

AU - Yang, J.

AU - Blaabjerg, F.

PY - 2017/9

Y1 - 2017/9

N2 - In respect to a Doubly-Fed Induction Generator (DFIG) system, its corresponding time scale varies from microsecond level of power semiconductor switching to second level of the mechanical response. In order to map annual thermal profile of the power semiconductors, different approaches have been adopted to handle the fundamental-frequency thermal cycles and load-varying thermal cycles. Their effects on lifetime estimation of the power device in the Back-to-Back (BTB) power converter are evaluated.

AB - In respect to a Doubly-Fed Induction Generator (DFIG) system, its corresponding time scale varies from microsecond level of power semiconductor switching to second level of the mechanical response. In order to map annual thermal profile of the power semiconductors, different approaches have been adopted to handle the fundamental-frequency thermal cycles and load-varying thermal cycles. Their effects on lifetime estimation of the power device in the Back-to-Back (BTB) power converter are evaluated.

KW - DFIG wind power system

KW - Lifetime estimation

KW - Thermal cycles

U2 - 10.1016/j.microrel.2017.06.069

DO - 10.1016/j.microrel.2017.06.069

M3 - Conference article in Journal

SN - 0026-2714

VL - 76-77

SP - 549

EP - 555

JO - Microelectronics Reliability

JF - Microelectronics Reliability

T2 - 28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)

Y2 - 25 September 2017 through 28 September 2017

ER -

Fundamental-frequency and load-varying thermal cycles effects on lifetime estimation of DFIG power converter

Abstract

Conference

Keywords

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AUB Link

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Projects

APETT: Advanced Power Electronic Technology and Tools

Cite this